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System-in-Package (SiP) and 3D Packaging for Mobile Applications

机译：适用于移动应用的系统级封装（SiP）和3D封装

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The packaging community is facing up daunting challenges to miniaturize the size, reduce the cost and shorten the time-to-market of IC packages for handsets and other mobile devices. Behind these challenges are two major intertwining trends in the handset technology - modularization and increased complexity and functionality. More and more functions are being incorporated into a handset, from PDA to MP3, and from camera to internet browsing. Increased functionality requires modularization and modularization enables more functions to be integrated into a handset. Modularization also enables miniaturization and cost reduction of the mobile device and reduces design cycle time. Increasingly, the industry witnesses the need for complete RF module and communication module solutions so that handset designers can spend less time worrying about the details of electrical design of the phone and, instead, focus on the applications and system functions. Many new packaging technologies and package types are developed to meet these stringent requirements of mobile communication. Among the most notable examples, system-in-package (SiP) and 3D packaging are being heavily invested and investigated. Each of these packaging technologies has different area of applications and unique properties. SiP modules could be as simple as a RFPA module and as complex as a complete WLAN module encompassing both radio and baseband sections. On the other hand, 3D packaging has the options of bare die stacking and package stacking, primarily for baseband and application sections. Number of ICs been stacked can range from 2 to the latest 6. Stacking of memory and processor IC抯 has the capability of integrating the entire baseband and application functions into a single module, greatly reduce the size of cellphones. SEMICON?China 2004 SEMI Technology Symposium ㏒EMI 2004 This paper provides an overview of packaging technologies for mobile applications. The materials and process considerations to meet the upcoming trend and challenges to IC packaging for mobile application are discussed. Likely supply chain issues arising from this new wave of integration are also addressed.
机译：为了使尺寸最小化，降低成本并缩短用于手机和其他移动设备的IC封装的上市时间，封装界面临着艰巨的挑战。这些挑战的背后是手机技术的两个主要相互交织的趋势-模块化以及复杂性和功能的增加。从PDA到MP3，从相机到互联网浏览，越来越多的功能被集成到手机中。功能性的提高要求模块化，而模块化使更多功能可以集成到手机中。模块化还实现了移动设备的小型化和成本降低，并缩短了设计周期。业界越来越多地看到对完整的RF模块和通信模块解决方案的需求，以便手机设计人员可以花费更少的时间来担心电话的电气设计细节，而专注于应用程序和系统功能。开发了许多新的包装技术和包装类型来满足移动通信的这些严格要求。在最著名的例子中，系统级封装（SiP）和3D封装正在大量投资和研究中。这些包装技术中的每一种都有不同的应用领域和独特的属性。 SiP模块可以像RFPA模块一样简单，也可以像包含无线电和基带部分的完整WLAN模块一样复杂。另一方面，3D封装具有裸芯片堆叠和封装堆叠的选项，主要用于基带和应用部分。堆叠的IC数量范围从2到最新的6。存储器和处理器的堆叠IC抯具有将整个基带和应用功能集成到单个模块中的能力，从而大大减小了手机的尺寸。 SEMICON China 2004 SEMI技术研讨会㏒EMI 2004本文概述了用于移动应用的封装技术。讨论了满足即将到来的趋势的材料和工艺方面的考虑以及对移动应用IC封装的挑战。这种新的整合浪潮可能引起的供应链问题也得到了解决。

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