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New Hot-Carrier Degradation Mechanism for MOSFET Devices Using Two-Type Interface-State Model

机译:使用两种接口状态模型的MOSFET器件新的热载流子降解机制

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We have studied the characteristics of MOSFET degradation induced by hot-carriers. When the characteristics of drain current degradation (ΔI_d) are applied to the stress time(t) dependence ΔI_d ∝ t~n, the exponent n is clearly different under different bias conditions. We present a two-type interface-state model composed of deep-energy interface states and shallow-energy interface states which have a different n exponent in order to explain the characteristics of drain current degradation.
机译:我们已经研究了热载流子引起的MOSFET退化的特性。当将漏极电流衰减特性(ΔI_d)应用于应力时间(t)依赖性ΔI_d∝ t〜n时,指数n在不同偏置条件下明显不同。为了解释漏极电流退化的特征,我们提出了一种由深能界面态和浅能界面态组成的两种界面态模型,它们具有不同的n指数。

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