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首页> 外文会议>Solid-state sensor and actuator workshop : Technical digest >MEMS-CONTROLLABLE MICROLENS ARRAY FOR BEAM STEERING ANDPRECISION ALIGNMENT IN OPTICAL INTERCONNECT SYSTEMS
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MEMS-CONTROLLABLE MICROLENS ARRAY FOR BEAM STEERING ANDPRECISION ALIGNMENT IN OPTICAL INTERCONNECT SYSTEMS

机译：用于光学互连系统中光束转向和 r n定位校准的MEMS可控微阵列

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摘要

Novel, 2-dimensional MEMS-controllable microlens arrayrnhas been integrated with a Vertical-Cavity-Surface-Emitting-Laserrn(VCSEL) array using a flip-chip assembly. The MEMSNCSELrnhybrid system is demonstrated for efficient and reliable smart pixelrnarrays for board-to-board or chip-to-chip optical interconnects inrndigital systems. By translating polymer microlens, fabricated on arnMEMS X-Y movable plate, using electro-thermal actuators, arnbeam steering angle of 70 mrad is achieved. VCSEL beam steeringrnwas successfully demonstrated in our MEMS/VCSEL hybridrnsystem to collimate and steer laser beam for a precision alignmentrnin a 2-dimensional free-space optical interconnect.
机译：新型的二维MEMS可控微透镜阵列已通过倒装芯片组件与垂直腔表面发射激光（VCSEL）阵列集成在一起。演示了MEMSNCSEL混合动力系统，该系统可用于数字系统中的板对板或芯片对芯片光学互连的高效，可靠的智能像素阵列。通过使用电热致动器平移在arnMEMS X-Y可移动板上制造的聚合物微透镜，实现了70 mrad的arnbeam转向角。 VCSEL光束转向系统已在我们的MEMS / VCSEL混合系统中成功演示，可在二维自由空间光学互连中准直和转向激光束以实现精确对准。

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  • 来源
  • 会议地点 Hilton Head Island SC(US)
  • 作者

    Adisorn Tuantranont; Victor M. Bright; Jianglong Zhang; Wenge Zhang; John Neff; Y. C. Lee;

  • 作者单位

    NSF Center for Advanced Manufacturing and Packaging of Microwave, Optical, and Digital Electronics (CAMPmode), Department of Mechanical Engineering, University of Colorado, Boulder, CO, USA 80309-0427 Tel: (303) 7351734, Fax: (303) 492-3498,email:Adisorn.Tuantranont@colorado.edu;

    NSF Center for Advanced Manufacturing and Packaging of Microwave, Optical, and Digital Electronics (CAMPmode), Department of Mechanical Engineering, University of Colorado, Boulder, CO, USA 80309-0427;

    NSF Center for Advanced Manufacturing and Packaging of Microwave, Optical, and Digital Electronics (CAMPmode), Department of Mechanical Engineering, University of Colorado, Boulder, CO, USA 80309-0427;

    NSF Center for Advanced Manufacturing and Packaging of Microwave, Optical, and Digital Electronics (CAMPmode), Department of Mechanical Engineering, University of Colorado, Boulder, CO, USA 80309-0427;

    NSF Center for Advanced Manufacturing and Packaging of Microwave, Optical, and Digital Electronics (CAMPmode), Department of Mechanical Engineering, University of Colorado, Boulder, CO, USA 80309-0427;

    NSF Center for Advanced Manufacturing and Packaging of Microwave, Optical, and Digital Electronics (CAMPmode), Department of Mechanical Engineering, University of Colorado, Boulder, CO, USA 80309-0427;

  • 会议组织
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 TM938.865;
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