首页> 外文会议>Symposium on Interconnects and Contact Metallization for ULSI Oct 17-22, 1999, Honolulu, HI >METAL CLAD LAYER FORMATION FOR CMOSFETs/SIMOX BY SELECTIVE CHEMICAL VAPOR DEPOSITION OF TUNGSTEN
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METAL CLAD LAYER FORMATION FOR CMOSFETs/SIMOX BY SELECTIVE CHEMICAL VAPOR DEPOSITION OF TUNGSTEN

机译:钨的选择性化学气相沉积法形成CMOSFET / SIMOX的金属覆层

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摘要

Selective chemical vapor deposition to form a tungsten-clad layer for CMOS/SIMOX devices is described. It is found that hydrogen plasma treatment produces a clean p~+-silicon surface. The addition of small amounts of oxygen to source gases in silane reduction of WF_6 promotes low-resistivity α-W growth. The combination of the hydrogen plasma treatment of the silicon surface before the deposition and the oxygen addition during the tungsten deposition enables the formation of a low-sheet-resistance clad layer with low-contact resistivity in LSIs without degrading the yield. The application of this selective tungsten chemical vapor deposition to 0.2-μm-gate CMOS/SIMOX devices exhibits excellent device performance.
机译:描述了用于形成用于CMOS / SIMOX器件的钨包覆层的选择性化学气相沉积。发现氢等离子体处理产生干净的p +硅表面。在WF_6的硅烷还原中向源气体中添加少量氧气可促进低电阻率α-W生长。沉积之前硅表面的氢等离子体处理和钨沉积期间的氧添加的结合使得能够在LSI中形成具有低接触电阻率的低薄层电阻包覆层,而不会降低产量。这种选择性钨化学气相沉积在0.2-μm栅CMOS / SIMOX器件上的应用表现出出色的器件性能。

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