Residual stresses in ultrathin metal sublayers within Au/Ni; multilayers

机译：Au / Ni中超薄金属亚层中的残余应力；多层

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Metallic Multilaysers (MLs) have attracted a considerable interest during these last years because of their unusual properties. In small periods ML's (a few nm) the high density of interfaces give rise to structures vry far from equilibrium.Au/Ni multilayers have been grown in the (111) orientation by M.B. E. on Si(100) buffer layer. Two different parameters have bene studied: the Au:Ni ratio at constant (4 nm) superperiod and the superperiod at constant (1:1) Au:ni ratio. The full strain state of Au and of Ni has been determined via x-ray diffraction measuredments. The high lattice parameter misfit between Au and Ni (14

机译：在最近几年中，金属多层板（MLs）由于其非同寻常的性能而引起了人们的极大兴趣。在很短的时间里（ML）（几纳米），界面的高密度使结构变得很不平衡.M.B使Au / Ni多层以（111）取向生长。 E.在Si（100）缓冲层上。已经研究了两个不同的参数：常数（4 nm）超周期的Au：Ni比和常数（1：1）Au：ni比率的超周期。已经通过X射线衍射测量确定了Au和Ni的全应变状态。 Au和Ni之间的高晶格参数失配（14

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《Symposium on Magnetic Ultrathin Films,Multilayers and Surface --1997 March 31-April 4,1997, San Francisco, California, U.S.A》|1997年|p.363-368|共6页
会议地点 San Francisco CA(US)
作者
S.Labat; P.Gergaud; O.Thomas; B.Gilles; A.Marty; S.Lefebvre;
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正文语种 eng
中图分类物理学;
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3. Interfacial reaction and mechanical reliability between Sn-3Ag-0.5Cu alloy and ultrathin-Ni(P)-type Au/Pd(P)/Ni(P)/Cu metallization pad [J] . Wu Y. S., Lee P. T., Hsieh W. Z., Surface & Coatings Technology . 2019,第期

机译：Sn-3Ag-0.5Cu合金与超薄 - Ni（P） - 型Au / Pd（P）/ Ni（P）/ Cu金属化垫之间的界面反应和机械可靠性
4. Residual stresses in ultrathin metal sublayers within Au/Ni; multilayers [C] . S.Labat, P.Gergaud, O.Thomas, Symposium on magnetic ultrathin films, multilayers and surfaces . 1997

机译：Au / Ni内超薄金属子层的残余应力;多层
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机译：13CR-4NI合金蠕变行为的研究，以模拟焊接后热处理过程中的残余应力再分布= 13CR-4NI合金蠕变行为的研究血清ang剩余ST的演变
6. Effects of the Manufacturing Process on the Reliability of the Multilayer Structure in MetalMUMPs Actuators: Residual Stresses and Variation of Design Parameters [O] . Jianbin Guo, Jinling Wang, Shengkui Zeng, 2017

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机译：制造工艺对MetalMUMPs执行器中多层结构可靠性的影响：残余应力和设计参数的变化

Residual stresses in ultrathin metal sublayers within Au/Ni; multilayers

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