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Intrinsic and Doped μc-Si:H TFT Layers using 13.56 MHz PECVD at 250℃

机译:固有和掺杂μc-Si:H TFT层,在250℃下使用13.56 MHz PECVD

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摘要

Undoped and n~+ hydrogenated microcrystalline silicon (μc-Si:H) films for thin film transistors (TFTs) were deposited at a temperature of 250℃ with 99 ~ 99.6 % hydrogen dilution of silane by standard 13.56 MHz plasma enhanced chemical vapor deposition (PECVD). High crystallinity μc-Si:H films were achieved at 99.6 % hydrogen dilution and at low rf power. An undoped 80 nm thick μc-Si:H film showed a dark conductivity of the order of 10~(-7) S/cm, the photosensitivity of an order of 10~2, and a crystalline volume fraction of 80 %. However, a 60 nm thick n~+ μc-Si:H film deposited using a seed layer showed a high dark conductivity of 35 S/cm and a crystalline volume fraction of 60 %. Using n~+ μc-Si:H films as drain and source contact layers in a-Si:H TFTs provides substantial performance improvement over n~+ a-Si:H contacts. Finally, fully μc-Si:H TFTs incorporating intrinsic μc-Si:H films as channel layers and n~+ μc-Si:H films as contact layers have been fabricated and characterized. These TFTs exhibit a low threshold voltage and a field effect mobility of 0.85 cm~2/Vs, and are far more stable under gate bias stress than a-Si:H TFTs.
机译:用于薄膜晶体管(TFT)的未掺杂和n〜+氢化的微晶硅(μc-Si:H)膜通过标准13.56 MHz等离子体增强化学气相沉积法在250℃的温度下沉积99%〜99.6%的硅烷氢稀释( PECVD)。在99.6%的氢气稀释和低rf功率下获得了高结晶度的μc-Si:H薄膜。未掺杂的80 nm厚μc-Si:H薄膜显示出10〜(-7)S / cm量级的暗电导率,10〜2量级的光敏度和80%的晶体体积分数。但是,使用籽晶层沉积的60 nm厚n〜+μc-Si:H薄膜显示出35 S / cm的高暗电导率和60%的晶体体积分数。在n- + a-Si:H TFT中,使用n〜+μc-Si:H膜作为a-Si:H TFT的漏极和源极接触层可显着提高性能。最后,已经制造并表征了完整的μc-Si:H TFT,其结合了固有的μc-Si:H膜作为沟道层和n〜+μc-Si:H膜作为接触层。这些TFT具有低阈值电压和0.85 cm〜2 / Vs的场效应迁移率,并且在栅极偏置应力下比a-Si:H TFT更稳定。

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