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Formation of p-type gallium nitride with zinc ion implantation

机译:锌离子注入形成p型氮化镓

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The process of Zn ion implantation and post - heat treatment of GaN films were developed. The Zn ion dose density was set at 5 x 10~(12), 5 x 10~(13) and 5 x 10~(14) cm~(-2) with 200keV energy. The activation was performed at 1100 deg C with a Zn metal coating on the GaN and vacuum sealed in puartz ampoule. The electrical results of these GaN samples indicated that this ion implantation process indeed convert the GaN film to be p - type electrical conductivity. The resistivity were in 2 approx 10 OMEGA -cm range with carrier concentration of 0.8 approx 2.6 x 10~(17) cm~(-3) and mobility of 7 approx 21 cm~2 / V.s. The PL spectrum also found that a 426 nm peak which may be related to Zn impurity.
机译:开发了Zn离子注入工艺和GaN薄膜的后热处理工艺。 Zn离子剂量密度设定为5×10〜(12),5×10〜(13)和5×10〜(14)cm〜(-2),能量为200keV。激活是在1100摄氏度下在GaN上镀锌金属并在puartz安瓿瓶中真空密封进行的。这些GaN样品的电学结果表明,该离子注入工艺确实将GaN膜转换为p型电导率。电阻率在2约10Ω-cm范围内,载流子浓度为0.8约2.6 x 10〜(17)cm〜(-3),迁移率为7约21 cm2 / v.s PL光谱还发现了426nm的峰,其可能与Zn杂质有关。

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