The Virtual Fab in Microelectronics: the Dry Etch case

机译：微电子学中的虚拟Fab：干蚀刻案例

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The dry-etch is a critical process step for microelectronic devices manufacturing. Indeed, the scaling down of the device feature-size imposes an increasing complexity of this technological process and, consequently, a cost increase of the Research and Development (R&D). The use of computational tool aimed to simulating the etching process should reduce substantially the R&D cost and time. Moreover, these tools are fundamental to improve the understanding of the etching microscopic mechanism. In general, a noteworthy reduction of the device development cost in whole production cycle can be achieved including these tools in the virtual fab, i.e. a set of numerical tools able to simulate the effects of the full process steps flow. In this paper we discuss the application of a profile evolution simulator as a tool of the virtual jab.

机译：干蚀刻是微电子器件制造的关键工艺步骤。实际上，缩小设备功能部件的大小会增加该技术过程的复杂性，并因此增加研究与开发（R＆D）的成本。旨在模拟蚀刻过程的计算工具的使用应大大减少研发成本和时间。此外，这些工具对于提高对蚀刻微观机理的理解至关重要。通常，可以在整个生产周期中显着降低设备开发成本，包括在虚拟工厂中使用这些工具，即一组能够模拟整个工艺步骤流程效果的数值工具。在本文中，我们讨论了配置文件演变模拟器作为虚拟戳戳工具的应用。

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《World Multiconference on Systemics, Cybernetics and Informatics(SCI 2002) v.6: Industrial Systems and Engineering I; 20020714-20020718; Orlando,FL; US》|2002年|P.40-45|共6页
会议地点 Orlando FL(US);Orlando FL(US)
作者
Giuseppe Garozzo; Antonino La Magna;
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作者单位

Central RD, St-Microelectronics, Stradale Primosole 50, 95121 Catania, Italy;

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会议组织
原文格式 PDF
正文语种 eng
中图分类计算技术、计算机技术;
关键词
virtual fab; dry etching; level set methods; ion-synergism model; etch-deposition model;

机译：虚拟晶圆厂;干法刻蚀;水平集方法;离子协同模型;刻蚀沉积模型;

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专利

1. An AlGaAs laser with high-quality dry etched mirrors fabricated using an ultrahigh vacuum in situ dry etching and deposition processing system [J] . Uchida M., Ishikawa S. IEEE Journal of Quantum Electronics . 1988,第11期

机译：使用超高真空原位干法刻蚀和沉积处理系统制造的具有高质量干法刻蚀镜的AlGaAs激光器
2. Wafer-Scale High-Quality Microtubular Devices Fabricated via Dry-Etching for Optical and Microelectronic Applications [J] . Saggau Christian N., Gabler Felix, Karnaushenko Dmitriy D., Advanced Materials . 2020,第37期

机译：晶圆级高质量微管器件通过干蚀刻制造光学和微电子应用
3. Effect of deposition temperature and thermal annealing on the dry etch rate of a-C: H films for the dry etch hard process of semiconductor devices [J] . Seung Moo Lee, Jaihyung Won, Soyoung Yim, Thin Solid Films . 2012,第16期

机译：沉积温度和热退火对半导体器件干法刻蚀工艺中a-C：H膜干法刻蚀速率的影响
4. The Virtual Fab in Microelectronics: the Dry Etch case [C] . Giuseppe Garozzo, Antonino La Magna World Multi-conference on Systemics, Cybernetics and Informatics . 2002

机译：微电子中的虚拟Fab：干蚀刻壳体
5. Plasma density control for reactivate ion etch variation reduction in industrial microelectronics. [D] . Klimecky, Pete Ivan. 2002

机译：等离子体密度控制，用于重新激活工业微电子中的离子刻蚀变化。
6. Assessing the Oxidative Degradation of N-Methylpyrrolidone (NMP) in Microelectronic Fabrication Processes by Using a Multiplatform Analytical Approach [O] . Gavin Lennon, Shannon Willox, Ragini Ramdas, 2020

机译：使用多平台分析方法评估微电子制造过程中N-甲基吡咯烷酮（NMP）的氧化降解
7. Annealing Studies of Nanoporous Si Thin Films Fabricated by Dry Etch [O] . Qing Hao, Yue Xiao, Fabian Javier Medina 2019

机译：干蚀刻制造的纳米多孔Si薄膜的退火研究
8. Photonic Crystal Fabrication in Lithium Nobate via Pattern Transfer Through Wet and Dry Etched Chromium Mask. [R] . Yavuzcetin, O., Novikov, H. P., Dally, R. L., 2012

机译：通过湿法和干法蚀刻铬掩模进行图案转移制备锂铌酸盐中的光子晶体。

The Virtual Fab in Microelectronics: the Dry Etch case

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