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Plastic deformation of silicon carbide crystals during the sublimation bulk growth process.

机译:升华体生长过程中碳化硅晶体的塑性变形。

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摘要

The purposes of this dissertation were to identify plastic deformation as a major dislocation formation mechanism during the physical vapor transport (PVT) growth of bulk SiC crystals, and to identify thermoelastic stress as the major cause of the deformation.; KOH etching and optical microscopy, transmission electron microscopy, and synchrotron white beam x-ray topography were used to directly observe deformation related dislocation structures in commercial SiC wafers.{09}Slip bands of threading edge and basal plane dislocations were identified indicating that plastic deformation does occur during the bulk growth.; The threading dislocation slip bands were aligned along the ⟨112¯0⟩ directions on the Si-face of KOH-etched wafers. The dislocations were shown to lie along the c-axis with Burgers vectors of the a/3⟨112¯0⟩ type. The threading edge dislocations also formed low angle grain boundaries aligned along the ⟨11¯00⟩ directions. These arrays were interpreted to form by polygonization of the dislocations introduced by plastic deformation.; The basal plane slip bands were aligned perpendicular to the off-cut direction on the Si-face of KOH-etched off-cut wafers. The length of the slip bands was consistent with the thermoelastic stress due to temperature distribution in growing crystals being the cause of the deformation. It was shown that gliding basal plane dislocations interact with grown-in polygonized domain walls and pile up against them, creating mixed-tilt domain boundaries.; The thermoelastic stress in a growing 6H-SiC crystal was calculated for a typical PVT process using a two dimensional finite element model. Based on the stress distribution, possible plastic deformation of the crystal was postulated.{09}The measured deformation in as-grown crystals was consistent with the postulated deformation indicating that the thermoelastic stress is an important dislocation formation mechanism during the PVT growth.; We have observed conversion of basal plane dislocations in off-axis 4H-SiC substrates into threading edge dislocations in the homo-epilayers. The conversion was interpreted as the result of an image force in the epilayers between flowing growth steps and basal plane dislocations. It is argued that this mechanism can cause an increase of the threading edge dislocation density in bulk crystals, and can lead to an apparent structural quality improvement of epilayers.
机译:本文的目的是确定塑性变形是块状SiC晶体物理气相传输(PVT)生长过程中的主要位错形成机理,并将热弹性应力确定为变形的主要原因。使用KOH蚀刻和光学显微镜,透射电子显微镜以及同步加速器白束X射线形貌直接观察了商用SiC晶片中与变形相关的位错结构。{09}确定了穿透边缘的滑移带和基面位错,表明塑性变形确实发生在批量增长期间。在KOH蚀刻晶片的Si面上,沿dis112′0〉方向排列了位错滑移带。结果表明,位错沿着 italia / 3〈112´0〉型的Burgers向量位于c轴上。螺纹边缘位错还形成了沿“ 11 00”方向排列的低角度晶界。这些阵列被解释为通过塑性变形引入的位错的多边形化而形成。基面滑带在KOH蚀刻后的切割晶片的Si面上垂直于切割方向排列。滑带的长度与热弹性应力一致,这是由于生长晶体中的温度分布是变形的原因。结果表明,滑动基底平面位错与生长的多边形畴壁相互作用并堆积在一起,形成混合倾斜的畴边界。使用二维有限元模型,针对典型的PVT工艺,计算了生长的6H-SiC晶体中的热弹性应力。根据应力分布,推测晶体可能发生塑性变形。{09}在生长的晶体中测得的变形与假定的变形一致,表明热弹性应力是PVT生长过程中重要的位错形成机制。我们已经观察到离轴4H-SiC衬底中的基面位错转换成均质表层中的穿线边缘位错。转化被解释为在外延层中流动的生长步骤和基面位错之间的图像力的结果。有人认为,这种机制可能导致块状晶体中穿线边缘的位错密度增加,并可能导致外延层的结构质量明显改善。

著录项

  • 作者单位

    Carnegie Mellon University.;

  • 授予单位 Carnegie Mellon University.;
  • 学科 Engineering Materials Science.; Physics Condensed Matter.
  • 学位 Ph.D.
  • 年度 2002
  • 页码 117 p.
  • 总页数 117
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 工程材料学;
  • 关键词

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