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Durability assessment and microstructural observations of selected solder alloys.

机译：选定焊料合金的耐久性评估和微观结构观察。

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摘要

The continuous miniaturization of electronic packages and systems combined with ever-decreasing product development cycles requires continuous refinement of the analytical and numerical models that are used as design tools and to predict the durability of products subjected to field or laboratory conditions. As the interconnect length scales approach the alloy microstructural feature sizes, the need to incorporate such small-scale parameters becomes more urgent. Likewise, shorter product development cycles combined with downward cost pressure necessarily restricts the time and resources available for carrying out experimental verification of product durability, consequently increasing the reliance on simulations for design validation. Solder interconnects have traditionally been and continue to be a weak link in most conventional electronic packages, so a more complete understanding of these materials is highly desirable. Furthermore, alternative interconnect materials, including those for high-temperature, lead-free and multi-stage processing applications, have only recently been studied and have been subjected to only the most basic characterization studies.; In this dissertation, the durability of two solder interconnect alloys, the standard Sn63Pb37 eutectic and an important lead-free alloy, is investigated using a combination of experimental and analytical techniques. A miniature, solid state, mechanical testing system is developed to provide a means for the testing in shear of solder alloy specimens with length scales similar to those seen in typical interconnects. Cyclic, durability tests are conducted over suitable ranges of amplitude, deformation rate and temperature using multiple test control algorithms; monotonic and load-controlled tests are also conducted at different temperatures and load levels. Macro-scale constitutive and durability behavior of the solder alloy can be observed and modeled directly from the basic experimental data (i.e. load and displacement histories). Localized behavior of the test solder joints is inferred from numerical analysis of the test structures and conditions.; In addition, several test durability test approaches and methodologies are evaluated. The effects of using different test control algorithms on durability modeling, consequences due to choice of failure definition, and the effect of accounting for the complete cyclic load history instead of traditional initial cycle metrics are examined.
机译：电子封装和系统的不断小型化以及不断减少的产品开发周期要求不断完善用作设计工具的分析和数值模型，并预测在现场或实验室条件下产品的耐用性。随着互连长度尺度接近合金的微观结构特征尺寸，纳入这种小尺度参数的需求变得更加迫切。同样，较短的产品开发周期和下降的成本压力必然会限制用于进行产品耐用性实验验证的时间和资源，因此增加了对仿真进行设计验证的依赖。焊锡互连传统上一直是并且仍然是大多数常规电子封装中的薄弱环节，因此非常需要对这些材料有更全面的了解。此外，替代互连材料，包括用于高温，无铅和多阶段加工应用的互连材料，仅在最近才进行研究，并且仅进行了最基本的特性研究。本文结合实验和分析技术，研究了两种焊料互连合金，即标准的Sn63Pb37低共熔合金和重要的无铅合金的耐久性。开发了一种微型的固态机械测试系统，以提供一种在长度比例类似于典型互连中所见的焊料合金试样的剪切力中进行测试的方法。使用多种测试控制算法，在合适的振幅，变形率和温度范围内进行循环耐久性测试；在不同的温度和负载水平下也进行单调和负载控制的测试。可以直接从基本实验数据（即载荷和位移历史）中观察并直接对焊料合金的宏观本构和耐久性行为进行建模。从测试结构和条件的数值分析可以推断出测试焊点的局部行为。另外，评估了几种测试耐久性测试方法和方法。研究了使用不同测试控制算法对耐久性建模的影响，由于选择失败定义而导致的后果以及考虑了完整的循环载荷历史而不是传统的初始循环指标的影响。

著录项

  • 作者

    Haswell, Peter Lewis.;

  • 作者单位

    University of Maryland College Park.;

  • 授予单位 University of Maryland College Park.;
  • 学科 Engineering Mechanical.
  • 学位 Ph.D.
  • 年度 2001
  • 页码 213 p.
  • 总页数 213
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 机械、仪表工业;
  • 关键词

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