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Finishing of advanced ceramic balls for bearing applications by magnetic float polishing (MFP) involving fine polishing followed by chemo-mechanical polishing (CMP).

机译:通过磁浮法抛光(MFP)精加工用于轴承的高级陶瓷球,包括精细抛光,然后进行化学机械抛光(CMP)。

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Scope and method of study. This investigation deals with the development of science and technology of finishing advanced ceramics, such as {dollar}rm Sisb3Nsb4{dollar} balls for bearing applications by magnetic float polishing (MFP) technology. Experimental design and analysis based on Taguchi method are applied to determine the optimum processing conditions for improving the surface quality in fine mechanical polishing by MFP technology. Polishing with various abrasives, different operating conditions, and polishing environments for {dollar}rm Sisb3Nsb4{dollar} bearing balls have been investigated. Fundamental mechanisms of chemo-mechanical polishing (CMP) have been studied based on thermodynamic and kinetic analysis.; Findings and conclusions. The methodology, involved mechanical polishing followed by CMP for finishing of {dollar}rm Sisb3Nsb4{dollar} balls from the as-received condition to a sphericity of 0.15 {dollar}mu{dollar}m and surface finish of Ra 4 nm by MFP technology has been developed. It takes about 20 hours to finish a batch of balls compared to a range of several weeks to several months by conventional grinding and polishing technology. High material removal rates (1 {dollar}mu{dollar}m/min) with minimal subsurface damage are possible by mechanical polishing with harder abrasives such as B{dollar}sb4{dollar}C or SiC in MFP. CeO{dollar}sb2{dollar} and ZrO{dollar}sb2{dollar} are found to be most effective abrasives followed by {dollar}rm Fesb2Osb3{dollar} and {dollar}rm Crsb2Osb3{dollar} for CMP of {dollar}rm Sisb3Nsb4.{dollar} CMP is found to be particularly effective in a water-based environment. There are similarities between polishing glass and polishing {dollar}rm Sisb3Nsb4{dollar} workmaterial including the role of water, polishing environment, and chemical effectiveness and mechanical hardness of abrasive for effective polishing.
机译:研究范围和方法。这项调查涉及精加工高级陶瓷的科学技术的发展,例如通过磁浮抛光(MFP)技术在轴承应用中使用的{rm} Sisb3Nsb4 {dollar}球。应用基于Taguchi方法的实验设计和分析,确定了通过MFP技术改善精细机械抛光表面质量的最佳工艺条件。已经研究了用各种研磨剂,不同的操作条件和{srmb} Sisb3Nsb4 {美元}轴承球的抛光环境进行抛光。基于热力学和动力学分析,研究了化学机械抛光(CMP)的基本机理。结论和结论。该方法涉及机械抛光,然后进行CMP,通过MFP技术将{rm} Sisb3Nsb4 {dol}球从收到的条件精加工到0.15 {μm}美元的球形度和Ra 4 nm的表面光洁度已经被开发出来。完成一批球需要大约20个小时,而传统的研磨和抛光技术则需要几周到几个月的时间。通过在MFP中使用较硬的磨料(例如Bs,sb4,C,SiC或SiC)进行机械抛光,可以实现较高的材料去除率(1μm/ min)/ min,并且具有最小的表面下损坏。发现CeO {dollar} sb2 {dollar}和ZrO {dollar} sb2 {dollar}是最有效的研磨剂,其次是{dollar} rm Fesb2Osb3 {dollar}和{dollar} rm Crsb2Osb3 {dollar},用于{dollar} rm的CMP。 Sisb3Nsb4。{dollar} CMP在水基环境中特别有效。抛光玻璃与抛光{s} Sisb3Nsb4 {dollar}工作材料之间存在相似之处,包括水的作用,抛光环境以及有效抛光的磨料的化学有效性和机械硬度。

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