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Interaction of multipactor discharge andrf structures.

机译:多重放电和rf结构的相互作用。

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Multipactor is a resonant, low-to-medium rf voltage breakdown phenomenon in microwave cavities, windows, and accelerator structures. A simple model is used to study the temporal evolution of a first-order, two-surface multipactor discharge and its interaction with the surrounding rf structure. The model assumes an infinitesimally thin sheet of electrons released with monoenergetic velocities in a parallel plate geometry.; The loading of the structure by the changing multipactor current, a combination of de-tuning and of reducing the quality factor of the resonant structure, is found to cause saturation. The steady state multipactor current has been derived analytically, and compares favorably with the computational results of the model. This current, properly normalized, is found to depend only on the magnitude of the drive current and the first cross-over point of the wall material's secondary yield curve (as well as the initial velocity of secondaries).; Transiently, the behavior of the multipactor depends on the quality factor of the rf structure. Non-resonant structures experience a fairly steady growth of the discharge towards the steady state level predicted by the theory. Highly-resonant structures, on the other hand, experience large oscillatory transients in the level of the discharge before it settles to the steady state. During these oscillations, the discharge feeds from the significant energy stored in the structure, and can be very damaging to the structure itself.; Simulations performed with two electron sheets instead of one reveal a novel phase-focusing mechanism in which one sheet grows at the expense of the other. This "cannibalism" results from the different impact energies, hence different yields, encountered by the different sheets (parts of the bunch). This mechanism may result in the multipactor electrons being very tightly bunched. However, this cannibalism operates on a relatively long time scale.; A multipactor discharge can take place during the "fill-time" of an rf structure, even if the operating voltage is above the multipactor region, provided the rise time of the voltage is sufficiently long. The conventional susceptibility diagram is modified to include the effects of surface materials. This is the first attempt where the dynamics of a multipactor discharge are linked to the material properties. Comparison with published experimental data is given.
机译:Multipactor是微波谐振腔,窗口和加速器结构中的谐振,中低频射频击穿现象。一个简单的模型被用来研究一阶,两面多齿放电的时间演化及其与周围射频结构的相互作用。该模型假设以平行板几何形状以单能速度释放无限薄的电子薄片。人们发现,通过改变多脚架电流,结构的负载,以及失谐和降低谐振结构的品质因数的组合,会导致饱和。通过分析得出了稳态多极电流,并将其与模型的计算结果进行了比较。正确归一化的电流仅取决于驱动电流的大小和壁材料的次级屈服曲线的第一个交叉点(以及次级的初始速度)。瞬态,multipactor的行为取决于射频结构的品质因数。非谐振结构会经历放电向理论所预测的稳态水平相当稳定的增长。另一方面,高谐振结构在放电稳定到稳态之前,会在放电水平经历较大的振荡瞬变。在这些振荡过程中,放电从结构中存储的大量能量中获取能量,并且可能对结构本身造成很大破坏。用两个电子片代替一个电子片进行的仿真揭示了一种新颖的相位聚焦机制,其中一个片以另一片为代价生长。这种“自相残杀”是由于不同的片材(束的一部分)遇到的不同的冲击能,因此产生了不同的产量。这种机制可能导致多极电子非常紧密地聚集在一起。但是,这种自相残杀行为的时间相对较长。只要工作电压高于多脚区域,即使电压上升时间足够长,也可以在rf结构的“填充时间”期间发生多脚放电。修改了常规磁化率图,以包括表面材料的影响。这是首次尝试将多排放电的动力学与材料特性联系起来。与公开的实验数据进行了比较。

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