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Design and Qualification of a Robust Polyurethane Based Conformal Coating Process for Sodimms

机译:Sodimms鲁棒性聚氨酯共形涂层工艺的设计和鉴定

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摘要

Conformal coatings protect printed circuit board assemblies, including the electronic components that the assemblies are populated with. A variety of materials and application methods can be used to conformally coat assemblies. The process setup is crucial to repeatable process reliability. The manual spray based conformal coating is widely used. This method of application was selected due to its compatibility, affordability, and efficiency with the required application. Polyurethanes, one of the families of conformal coatings, provide resistance against abrasion, heat, and chemicals while reducing the risk of tin whiskers. In order to minimize the need for rework and create an efficient, repeatable and reproducible process, an option is to automate the process of conformal coating application. This research addressed the research and development of a process specific to SODIMM type memory modules using a two-component polyurethane based conformal coating material. The yield was improved by systematically working on quality by analyzing yield improvements while preventing observed defects. A 'DoE" based approach was used. Upon validating 'optimal' input configurations, the overall process qualification was executed for controlled lots which were then analyzed for visual defects and thickness establishing process effectiveness. The sub-processes for the conformal coating process include board wash, ionograph test, masking, plasma cleaning, conformal coating spray, and cure. The board wash sub-process was qualified using three different temperature and time durations as inputs.;When examined under a microscope, white residue was observed for lower temperature configurations. Next, ionograph tests were conducted to verify ionic contamination levels on the surface of the SODIMM products and it was observed that all samples passed. It was observed that an oxygen-based plasma cleaning process provided the minimum contact angles of 8° or below. Argon, by itself, performed equally well but the mixture of the two gases resulted in an angle greater than 8°; hence oxygen was selected. It was seen that the metalized surfaces of the components exhibited thinner deposits of coating than the other areas on board. The final program was modified to accommodate for cross-directional passes and an air tack time of an hour to resolve the observed issue, which turned out to be a successful solution. Controlled lots were processed and inspected for coating thickness. No additional defects were observed. This research has also helped in identifying potential opportunities for improvement.
机译:保形涂层可保护印刷电路板组件,包括组装有电子组件的电子组件。可以使用多种材料和涂覆方法来保形地涂覆组件。流程设置对于可重复的流程可靠性至关重要。手动喷涂的保形涂料已被广泛使用。选择该应用程序方法是因为其与所需应用程序的兼容性,可负担性和效率。保形涂料家族中的一种,聚氨酯,具有耐磨性,耐热性和耐化学性,同时降低了锡须的风险。为了最大程度地减少返工的需求并创建有效,可重复和可重复的过程,一种选择是使保形涂料的涂覆过程自动化。这项研究致力于研究和开发使用基于二组分聚氨酯的保形涂料的SODIMM类型存储模块的工艺。通过在防止观察到缺陷的同时分析良率提高来系统地研究质量,从而提高良率。使用基于“ DoE”的方法,在验证“最佳”输入配置后,对受控批次执行总体过程鉴定,然后分析外观缺陷和厚度确定过程有效性。保形涂层过程的子过程包括板材清洗,离子测试,掩膜,等离子清洗,保形涂层喷涂和固化;使用三种不同的温度和持续时间作为输入,对板清洗子工艺进行了鉴定;在显微镜下检查时,观察到白色残留物的温度较低接下来,进行了离子色谱仪测试以验证SODIMM产品表面的离子污染水平,并观察到所有样品均通过,并观察到基于氧的等离子体清洁工艺提供的最小接触角为8°或以下。氩气本身的性能同样好,但是两种气体的混合物形成的夹角大于8°;因此选择了氧气ed。可以看出,部件的金属化表面比板上的其他区域具有更薄的涂层沉积。最终程序进行了修改,以适应横向通过和一个小时的空打时间来解决所观察到的问题,事实证明这是一个成功的解决方案。处理受控批次并检查涂层厚度。没有观察到其他缺陷。这项研究还有助于确定潜在的改进机会。

著录项

  • 作者

    Dhiman, Rajat.;

  • 作者单位

    State University of New York at Binghamton.;

  • 授予单位 State University of New York at Binghamton.;
  • 学科 Industrial engineering.
  • 学位 M.S.
  • 年度 2018
  • 页码 89 p.
  • 总页数 89
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 水产、渔业;
  • 关键词

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