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Process analysis and performance characterization of a novel anisotropic conductive adhesive for lead -free surface mount electronics assembly

机译：用于无铅表面贴装电子组件的新型各向异性导电胶的工艺分析和性能表征

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作者
Ramkumar, S. Manian;
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作者单位

State University of New York at Binghamton;

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授予单位 State University of New York at Binghamton;
学科
学位 Ph.D.
年度 2007
页码 313 p.
总页数 313
原文格式 PDF
正文语种 eng
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专利

1. A Novel Anisotropic Conductive Adhesive for Lead-Free Surface Mount Electronics Packaging [J] . S. Manian Ramkumar, Krishnaswami Srihari Journal of Electronic Packaging . 2007,第2期

机译：一种用于无铅表面贴装电子封装的新型各向异性导电胶
2. Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications [J] . Yi Li, C.P. Wong Materials Science & Engineering. R, Reports . 2006,第1a3期

机译：导电胶作为电子包装中无铅替代品的最新进展：材料，工艺，可靠性和应用
3. High performance anisotropic conductive adhesives for lead-free interconnects [J] . Yi Li, C. P. Wong Soldering & Surface Mount Technology . 2006,第2期

机译：用于无铅互连的高性能各向异性导电胶
4. Influence of process parameters on component assembly and drop test performance using a novel Anisotropic Conductive Adhesive for lead-free surface mount assembly [C] . Manian Ramkumar S., Srihari K. Electronic Components and Technology Conference . 2008

机译：使用新型各向异性导电粘合剂对无铅表面安装组件的工艺参数对部件组装和跌落测试性能的影响
5. Lead-free solders in surface mount electronic assemblies: Designs for quality and reliability [D] . Dang, Tung C. 2011

机译：表面安装电子组件中的无铅焊料：质量和可靠性设计
6. Analysis of Hot Bar Soldering Insulation Displacement Connections (IDC) and Anisotropic Conductive Adhesives (ACA) for the Automated Production of Smart Textiles [O] . Sebastian Micus, Ivan Kirsten, Michael Haupt, 2020

机译：分析用于自动生产智能纺织品的热压焊绝缘置换连接（IDC）和各向异性导电胶（ACA）
7. Influence of Process Parameters on Component Assembly and Drop Test Performance using a Novel Anisotropic Conductive Adhesive for Lead-free Surface Mount Assembly [O] . S. Manian Ramkumar, Ph. D, K. Srihari 2015

机译：工艺参数对新型各向异性导电胶用于无铅表面贴装组件的元件装配和跌落测试性能的影响
8. Compatibility of lead-free solders with lead containing surface finishes as a reliability issue in electronic assemblies [R] . Vianco, P. , Rejent, J. , Artaki, I. , 1996

机译：无铅焊料与含铅表面处理的兼容性是电子组件中的可靠性问题

Process analysis and performance characterization of a novel anisotropic conductive adhesive for lead -free surface mount electronics assembly

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