Seml--flxecl abrasive machining experiments were perlormea to analyze the lnnuences ut several factors on the ＇trap＇ effect of SFAP. These influencing factors were as the concentration and size of large grains, hardness of SFAP, processing load and rotating speed of SFAP. The workpieces were damage--free single crystal silicon after polishing, its surface roughness Ra after semi--fixed machining was measured and adopted as the parameter of evaluating the extent of ＇trap＇ effect. These work indicates that for large grains with certain size, when the number of large grains is not more than the threshold one, all large grains embed into SFAP. The ＇trap＇ effect of SFAP decreases with the increase of large grain size, SFAP hardness, or processing load.%以抛光后无表面损伤的单晶硅片为试件，以表面粗糙度Ra为指标，对半固着磨具的“陷阱”效应进行试验分析，讨论大颗粒浓度及尺寸、磨具硬度、加工载荷、磨具转速对“陷阱”效应的影响。研究结果表明：对一定尺寸的大颗粒，当大颗粒数量不超过临界值时，大颗粒可全部陷入，“陷阱”效应发挥；当大颗粒尺寸较大、磨具硬度较高、加工载荷较大时，不利于“陷阱”效应发挥。‘
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