Because micromanipulation stage was often woking in an environment with randomly changing temperature ,the robust optimization design of the stage based on Taguchi method was proposed in order to reduce the influence of temperature on the performance variation of the mi‐cro‐manipulation stage .Taking a novel one‐dimentional micromanipulation stage as study object , the finite element method was applied to build the model of thermal error of the stage considering temperature effect .The relationship between thermal error and structure parameters was ana‐lyzed based on the model ,and then the control factors were chosen ,which had greater impact on the thermal errors of the stage .Taking the thermal error as smaller‐the‐better characteristic ,the temperature and thermal expansion coeffcient as noise factors ,the structual parameters as control factors ,the optimal level of the control factors were determined by using the orthogonal experi‐ment design and the main effect analysis .By comparing the mean and variance of the thermal er‐ror before and after optimization ,the results showed that they were reduced by 16 .03% and 12.07% respectively ,and which illustrated the temperature effect of the stage could be reduced by the proposed robust optimization design .%由于微操作平台往往处于随机变化的温度环境中，提出一种基于田口方法的稳健优化设计以减小温度效应对其性能波动的影响．以一种新型一维微操作平台为对象，采用有限元方法建立计入温度效应的平台热误差模型，并基于该模型分析平台结构参数与热误差之间关系，由此选出对平台热误差影响较大的参数作为控制因子．以热误差为望小特性，温度变化和热膨胀系数为噪声因子，结构参数为控制因子，通过正交试验设计和主效应分析，确定控制因子的最佳水平组合点．通过比较分析优化前与优化后热误差的均值和方差，结果表明它们分别减小了16.03％和12.07％，说明可通过所提出的稳健优化设计方法减小平台的温度效应．
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