以离子液体1-丁基磺酸-3-甲基咪唑三氟甲烷磺酸盐([BSO3HMIm] OTf)为浸出剂,初步研究了WPCBs浸铜过程中锌和铅浸出率的影响因素.实验结果表明:铜、锌的浸出率随着WPCBs粒径的减小、H2O2溶液加入量的增大而增大,铜的浸出率随浸出温度的升高先增大后减小,锌的浸出率受浸出温度影响不大;铅的浸出率受5种因素影响不大,且总体处于较低水平.在WPCBs粒径为0.100～0.250 mm、离子液体加入量为60.0％(ψ)、H2O2溶液加入量为7.5％(ψ)、固液比为1∶15、浸出温度为50℃的条件下,铜、锌、铅的浸出率分别为99.84％,93.25％,22.46％.%The effects on lead and zinc leaching in the process of copper leaching from waste printed circuit boards (WPCBs) by ionic liquid [BSO3HMIm] OTf were investigated.The experimental results showed that:The leaching rate of copper,zinc was increased with the decrease of WPCBs particle size,solid-liquid ratio and the increase of H2O2 solution amount,ionic liquid amount;The copper leaching rate was inceased firstly and then decreased with the increase of leaching temperature,whilc the zine leaching rate was slightly affected by leaching temperature;The lead leaching rate was slightly affected by the 5 factors and was always at a low level;Under the conditions of WPCBs particle size 0.100-0.250 mm,ionic liquid amount 60.0％ (ψ),H2O2 solution amount 7.5％ (ψ),solid-liquid ratio 1 ∶ 5 and leaching temperature 50 ℃,the leaching rate of copper,zinc,lead was 99.84％,93.25％,22.46％,respectively.
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