SiCp/6063Al composite containing high and low volume fraction SiC after electroless nickel plating were soldered by using Sn3.0Ag0.5Cu3.0Bi solder in vacuum.The vacuum soldered joint microstructure between SiCp/6063Al composite after electroless nickel plating and the effect of holding time on the property of joint were stu-died by means of SEM and shearing test.The results showed that the microstructure of soldering seam was quite com-pact since the lead-free solder could wet SiCp/6063Al composite after electroless nickel plating very well.The shear strength of the soldered joint reached to maximum of 38.3 MPa under soldering temperature of 270 ℃ and holding time for 35 min.The element Sn and Cu from the solder reacted with Ni on the SiCp/6063Al composite,resulting in a metallurgical bonding between the solder and base material.The fracture mode of soldered joint of the SiCp/6063Al composite after electroless nickel plating was mixed ductile mainly of ductile fracture.Fracture occurred in the solder mostly and occurred around the IMC layer rarely.%采用 Sn3.0Ag0.5Cu3.0Bi 软钎料对镀镍后的两种不同体积比 SiCp/6063Al 复合材料进行真空钎焊。通过 SEM、剪切试验等方法分析了化学镀镍后 SiCp/6063Al 复合材料真空钎焊接头的显微组织以及保温时间对接头性能的影响。结果表明：两种不同体积比 SiCp/6063Al 复合材料真空钎焊后的焊缝组织致密，钎料对镀镍复合材料的润湿性良好；在270℃、保温35 min 的钎焊工艺下，钎焊接头的剪切强度最大值为38.3 MPa；钎料中的 Sn、Cu 元素能够与复合材料表面的 Ni 层发生化学反应，实现钎料与母材的冶金结合；镀镍后 SiCp/6063Al 复合材料真空钎焊接头断裂形式为韧性断裂为主的混合断裂，断裂主要发生在钎料内部，部分发生在镀镍层与钎料的结合处。
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