With the rapid development of MEMS,TRIZ and CAD tools,the MEMS devices can be designed and produced with low cost and high efficiency. The flexibility design has been widely used in microelectronic devices,which can solve the problem occurring in packaging process of the MEMS devices. In packaging and welding process of the MEMS devices,since the coefficient of thermal expansion between the chip material and substrate material is mismatched,which can cause more stress relief when the external temperature changes,so the electronic packaging deviation will be generated. The innovative methods of TRIZ-based flexibility design and CAD welding technology are proposed by taking the chip of infrared remote sensor as the re-search object,in which the conflict matrix is used to express the relationship between the conflict parameter and resolution prin-ciple,so the general solution of the welding technology problem is obtained. The analysis shows that the LED chip deformation problem can be solved by adding the chip folding length and decreasing the folding distance,and then the short life problem of the infrared camera is settled. The proposed method can boost the development of the flip-chip technology,and then the re-search of TRIZ theory applied in forestry equipment is promoted.%随着微机电系统、TRIZ和CAD tools的迅速发展,MEMS器件可以经济高效的设计和生产出来.柔性设计被越来越多地应用到微型电子器件中,可以解决MEMS器件在封装过程中出现的问题.在MEMS器件封装、焊接过程中,由于芯片材料和衬底材料之间热膨胀系数的不匹配,导致在外界温度变化时的应力释放过多,进而造成电子封装偏差.这里以红外遥感器的芯片为研究对象,提出了基于TRIZ 的柔性设计创新方法及CAD焊接工艺的创新方法,用冲突矩阵表达冲突参数和解决原理间的关系,据此得出焊接工艺问题的一般解.经过分析得出,增加芯片折叠长度和减少折叠间距可以解决LED芯片变形问题,进而解决红外摄像机寿命短的问题.这一方法的提出,能够促进倒装焊接技术的发展,继而推动TRIZ理论在林业装备的进一步应用.
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