With the rapid development of the semiconductor industry,standard sized wafer processing has become mature and processing equipment have become more sophisticated and highly automated. But there is no corresponding professional equipment for non-standard silicon wafer processing,and great differences exist among processing technologies. In this paper,based on existing production equipment in the company,thickness value differences were compared through meas-urement of wax stuck wafers to find out preferable non-standard silicon wax sticking technologies.%随着国际半导体工业的迅猛发展，标准尺寸硅片加工技术愈发成熟，加工设备自动化程度越来越高。但非标硅片的加工并没有相应的专业设备，其加工工艺也存在着极大的差异。以公司现有生产设备条件为基础，通过测量粘蜡后硅片的厚度，对比厚度值差异，寻找出较好的非标硅片粘蜡技术。
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