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首页> 外文期刊>Applied Surface Science >Effect of Cu content on microstructure, mechanical and anti-fouling properties of TiSiN-Cu coating deposited by multi-arc ion plating
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Effect of Cu content on microstructure, mechanical and anti-fouling properties of TiSiN-Cu coating deposited by multi-arc ion plating

机译：铜含量对多弧离子镀TiSiN-Cu涂层组织，抗污性能的影响

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摘要

The copper-doped TiSiN coatings were deposited on 316L stainless steel by reactive co-sputtering in multi-arc ion plating. The surface morphology and structure of the coating were analyzed by scanning electron microcopies, X-ray diffraction and X-ray photoelectron spectroscopy. The hardness was tested using Nano-indentation. The influence of the copper content in the coatings on the structure and mechanical properties of TiSiN-Cu coatings was investigated. Antifouling behaviors of the coatings were evaluated by analyzing adhesion and propagation of P.tricornutum, N.closterium, and Chlorella sp. The TiSiN-Cu coatings had a unique structure of amorphous Si3N4 and nanocrystalline nc-TiNc-Cu. The Cu-TiSiN coatings can inhibit effectively attachment and colonization of the algae on the surface. When the copper content increases from 6.75 at.% to 25.15 at.%, the coatings show an obvious decrease in hardness, significantly increase in the surface roughness and greatly weaken in antifouling properties. When the copper content is 6.75 at.%, the coating has the highest hardness with 30 GPa, and the best reduction ratio with 89%, 93% and 57% attachment of P.triceratium, N.closterium and Chlorella sp., respectively. The TiSiN-Cu coating with a copper dosage of 6.75 at.% has the excellent mechanical properties and capability of killing effectively microalgae. (C) 2017 Elsevier B.V. All rights reserved.
机译：通过多弧离子镀中的反应性共溅射，将铜掺杂的TiSiN涂层沉积在316L不锈钢上。通过扫描电子显微照片，X射线衍射和X射线光电子能谱分析涂层的表面形态和结构。使用纳米压痕测试硬度。研究了涂层中铜含量对TiSiN-Cu涂层结构和力学性能的影响。涂层的防污性能通过分析毛霉，粘虫和小球藻的粘附和繁殖来评估。 TiSiN-Cu涂层具有独特的非晶态Si3N4和纳米晶nc-TiN / nc-Cu结构。 Cu-TiSiN涂层可以有效抑制藻类在表面上的附着和定居。当铜含量从6.75at。％增加到25.15at。％时，涂层的硬度明显降低，表面粗糙度明显增加，并且防污性能大大减弱。当铜含量为6.75 at。％时，该涂层具有最高的硬度（30 GPa）和最佳的还原率，分别具有89％，93％和57％的P.triceratium，N.closterium和Chlorella sp。附着。铜用量为6.75 at。％的TiSiN-Cu涂层具有出色的机械性能和有效杀死微藻的能力。 （C）2017 Elsevier B.V.保留所有权利。

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  • 来源
    《Applied Surface Science》 |2018年第ptab期|444-451|共8页
  • 作者

    Bai Xuebing; Li Jinlong; Zhu Lihui; Wang Liping;

  • 作者单位

    Chinese Acad Sci, Ningbo Inst Mat Technol & Engn, Zhejiang Key Lab Marine Mat & Protect Technol, Lab Marine Mat & Related Technol, Ningbo 315201, Zhejiang, Peoples R China|Shanghai Univ, Sch Mat Sci & Engn, Shanghai 200072, Peoples R China;

    Chinese Acad Sci, Ningbo Inst Mat Technol & Engn, Zhejiang Key Lab Marine Mat & Protect Technol, Lab Marine Mat & Related Technol, Ningbo 315201, Zhejiang, Peoples R China;

    Shanghai Univ, Sch Mat Sci & Engn, Shanghai 200072, Peoples R China;

    Chinese Acad Sci, Ningbo Inst Mat Technol & Engn, Zhejiang Key Lab Marine Mat & Protect Technol, Lab Marine Mat & Related Technol, Ningbo 315201, Zhejiang, Peoples R China;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    TiSiN-Cu coatings; Arc ion plating; Structure; Microalgae; Anti-fouling;

    机译：TiSiN-Cu涂层;电弧离子镀;结构;微藻;防污;

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