机译:非晶硼和碳化硼与硅和铜的界面处的价带偏移和肖特基势垒
Logic Technology Development, Intel Corporation, 5200 NE Elam Young Parkway, Hillsboro, OR 97124, USA;
Logic Technology Development, Intel Corporation, 5200 NE Elam Young Parkway, Hillsboro, OR 97124, USA;
Logic Technology Development, Intel Corporation, 5200 NE Elam Young Parkway, Hillsboro, OR 97124, USA;
Ocotillo Materials Laboratory, Intel Corporation, 4500 S. Dobson Road, Chandler, AZ 85248, USA;
Logic Technology Development, Intel Corporation, 5200 NE Elam Young Parkway, Hillsboro, OR 97124, USA;
Logic Technology Development, Intel Corporation, 5200 NE Elam Young Parkway, Hillsboro, OR 97124, USA;
Logic Technology Development, Intel Corporation, 5200 NE Elam Young Parkway, Hillsboro, OR 97124, USA;
Logic Technology Development, Intel Corporation, 5200 NE Elam Young Parkway, Hillsboro, OR 97124, USA;
Boron; Carbide; XPS; Valence band offset; Amorphous;
机译:非晶态六方氮化硼与硅网络电介质的界面处的价和导带偏移
机译:非晶态六方氮化硼与硅网络电介质的界面处的价和导带偏移
机译:非晶氢化氮化硼-硅(100)界面的价带偏移
机译:无定形硼碳化物/硅界面的价带偏移
机译:在6H-碳化硅和15R-碳化硅衬底上生长的砷化硼外延层的缺陷结构和生长机理。
机译:通过加入硅熔体中加入硼的环保制备反应键合碳化硅
机译:晶体硅和非晶硅(亚)氧化物之间的异质结的价带偏移(A-SiOx:H,0
机译:碳化硼和碳化硼+碳化硅混合物的制备开发可能用于pWR-2中的可挽救毒物