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The Optimization Of Incident Angles Of Low-energy Oxygen Ion Beams For Increasing Sputtering Rate On Silicon Samples

机译:提高硅样品溅射速率的低能氧离子束入射角的优化

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摘要

In order to determine an appropriate incident angle of low-energy (350-eV) oxygen ion beam for achieving the highest sputtering rate without degradation of depth resolution in SIMS analysis, a delta-doped sample was analyzed with incident angles from 0° to 60° without oxygen bleeding. As a result, 45' incidence was found to be the best analytical condition, and it was confirmed that surface roughness did not occur on the sputtered surface at 100-nm depth by using AFM. By applying the optimized incident angle, sputtering rate becomes more than twice as high as that of the normal incident condition.
机译:为了确定合适的低能量(350-eV)氧离子束入射角以实现最高的溅射速率而不会降低SIMS分析中的深度分辨率,我们分析了入射角从0°到60°的掺sample样品°无氧气流血。结果,发现45'入射是最佳的分析条件,并且通过使用AFM证实了在100nm深度的溅射表面上没有出现表面粗糙度。通过应用最佳入射角,溅射速率将变为正常入射条件的两倍以上。

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