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Mechanism Of The Etching Rate Change Of Aluminosilicate Glass In Hf Acid With Micro-indentation

机译:微压痕法研究铝硅酸盐玻璃在H酸中的刻蚀速率变化机理

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摘要

The etching rate of some kind of glass decreases with micro-indentation. This paper is concerned chiefly with the mechanism for aluminosilicate glass. The change of glass surface condition arising from the indentation and the etching has been examined with X-ray photoelectron spectroscopy (XPS). It was found that the leaching reaction observed through the HF acid etching at non-indented area was restricted at the indented area. The etching rate change should be attributed to the leaching mechanism.
机译:某种玻璃的蚀刻速率会随着微压痕而降低。本文主要涉及硅铝酸盐玻璃的机理。已经通过X射线光电子能谱法(XPS)检查了由压痕和蚀刻引起的玻璃表面状态的变化。已经发现,通过HF酸蚀刻在非凹入区域观察到的浸出反应被限制在凹入区域。蚀刻速率的变化应归因于浸出机理。

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