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XRR and GISAXS study of silicon oxynitride films

机译:氮氧化硅薄膜的XRR和GISAXS研究

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Thin films of silicon oxynitride have largely replaced pure silicon oxide films as gate and tunnel oxide films in modem technology due to their superior properties in terms of efficiency as boron barrier, resistance to electrical stress and high dielectric strength. A single chamber system for plasma enhanced chemical vapor deposition was employed to deposit different films of SiOxNyHz with 0.85 < x < 1.91. All films were previously characterized by Rutherford back-scattering and infrared spectroscopy to determine the stoichiometry and the presence of various bonding configurations of constituent atoms. We used X-ray rellectivity to determine the electron density profile across the depth, and we showed that the top layer is densified. Moreover, grazing incidence small-angle X-ray scattering was used to study inhomogeneities (clustering) in the films, and it is shown that plate-like inhomogeneities exist in the top and sphere-like particles at the bottom part of the film. Their shape and size depend on the stoichiometry of the films. (c) 2006 Elsevier B.V. All rights reserved.
机译:在现代技术中,氧氮化硅薄膜已在很大程度上取代了纯氧化硅膜,成为栅氧化层和隧道氧化膜,这是因为它们在硼阻挡层的效率,抗电应力和高介电强度方面具有优越的性能。采用用于等离子体增强化学气相沉积的单腔系统来沉积0.85

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