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Sub-10 nm vertical tunneling transistors based on layered black phosphorene homojunction

机译:基于层状黑色磷同质结的低于10 nm垂直隧穿晶体管

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摘要

Van der Waal (vdW) stacking of two-dimensional (2D) semiconductors owns a natural configuration for construction of vertical (interlayer) tunneling field effect transistors (TFETs). We simulate the vertical TFETs composed by layered black phosphorene (BP) homojunction at sub-10 nm scale from the ab initio quantum transport calculations. For high-performance (HP) application, the on-state currents (I-on) of the vertical BP TFETs outperform those of their planar counterparts under similar gate length (L-g) at sub-5 nm scale. Remarkably, the vertical BP TFETs extend the application field to low-power (LP) devices compared with their planar counterparts. Both I-on (LP) and I-on (HP) of the vertical BP TFETs can fulfill the LP and HP requirements of the international technology roadmap for semiconductors (ITRS) until L-g is scaled down to 5 and 3 nm, respectively.
机译:二维(2D)半导体的范德华(vdW)堆叠拥有用于构造垂直(层间)隧穿场效应晶体管(TFET)的自然配置。我们从头算量子传输计算中,模拟了亚10纳米以下层状黑色磷光体(BP)同质结组成的垂直TFET。对于高性能(HP)应用,垂直BP TFET的导通状态电流(I-on)在低于5 nm的相似栅极长度(L-g)下要优于其平面同类产品。值得注意的是,与平面BP TFET相比,垂直BP TFET将其应用领域扩展到了低功率(LP)器件。垂直BP TFET的I-on(LP)和I-on(HP)均可满足国际半导体技术路线图(ITRS)的LP和HP要求,直到L-g分别缩小至5 nm和3 nm。

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