TECNISCO Lifts Sealing Performance of TGV for MEMS Devices

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TECNISCO Lifts Sealing Performance of TGV for MEMS Devices

机译：TECNISCO提升TGV用于MEMS器件的密封性能

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Japan-based TECNISCO, LTD., a member of Disco Group, has developed a unique technology, a related electrical feed through contact in glass wafers (Through Glass Via: TGV), which can be applied in micro electro mechanical systems (MEMS). According to Keizo Sekiya, President and Representative Director of TECNISCO,

机译：总部位于日本的TECNISCO，LTD。是Disco Group的成员，已开发出一项独特的技术，即通过与玻璃晶片（Through Glass Via：TGV）进行接触而产生的相关电馈送，该技术可应用于微机电系统（MEMS）。 TECNISCO总裁兼代表董事Keizo Sekiya认为，

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《Asia electronics industry》 |2011年第9期|p.75|共1页
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TECNISCO Lifts Sealing Performance of TGV for MEMS Devices

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