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Understanding mechanical behavior and reliability of organic electronic materials

机译：了解有机电子材料的机械性能和可靠性

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The mechanical properties of organic electronic materials and interfaces play a central role in determining the manufacturability and reliability of flexible and stretchable organic electronic devices. The synergistic effects of mechanical stress and deformation, together with other operating parameters such as temperature and temperature cycling, and exposure to solar radiation, moisture, and other environmental species are particularly important for longer-term device stability. We review recent studies of basic mechanical properties such as adhesion and cohesion, stiffness, yield behavior, and ductility of organic semiconducting materials, and their connection to underlying molecular structure. We highlight thin-film metrologies to probe the mechanical behavior, including when subjected to simulated operational conditions. We also report on strategies for improving reliability through interface engineering and tailoring material chemistry and molecular structure. These studies provide insights into how these metrologies and metrics inform the development of materials and devices for improved reliability.
机译：有机电子材料和界面的机械性能在确定柔性和可拉伸有机电子设备的可制造性和可靠性方面起着核心作用。机械应力和变形以及其他工作参数（例如温度和温度循环）以及暴露于太阳辐射，湿气和其他环境物质的协同效应对于长期设备稳定性特别重要。我们回顾了对基本机械性能的最新研究，这些性能包括有机半导体材料的粘附力和内聚力，刚度，屈服行为和延展性，以及它们与基础分子结构的联系。我们重点介绍了薄膜力学，以探测机械性能，包括在模拟操作条件下的性能。我们还报告了通过界面工程以及定制材料化学和分子结构来提高可靠性的策略。这些研究提供了有关这些计量学和度量标准如何指导材料和设备开发以提高可靠性的见解。

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