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首页> 外文期刊>Chinese journal of aeronautics >Fabrication and Life Prediction of SSiC Ceramic Joint Joined with Silicon Resin YR3370
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Fabrication and Life Prediction of SSiC Ceramic Joint Joined with Silicon Resin YR3370

机译：SSiC陶瓷结合硅树脂YR3370的制备及寿命预测

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摘要

Joints between sintered silicon carbide (SSiC) were produced using a polysiloxane silicon resin YR3370 (GE Toshiba Silicones) as joining material. Samples were heat treated in a 99.99% nitrogen flux at temperatures ranging from 1 100 ℃ to 1 300 ℃. Three point bending strength of the joint reached the maximum of 179 MPa as joined at 1 200 ℃. The joining layer is continuous, homogeneous and densified and has a thickness of 2 μm -5 μm. The joining mechanism is that the amorphous silicon oxycarbide (Si_xO_yC_z) ceramic pyro-lyzed from silicon resin YR3370 acts as an inorganic adhesive to SSiC substrate, which means the formation of the continuous Si-C bond structure between Si_xO_yC_z structure and SSiC substrate. Life prediction of the ceramic joint can be realized through the measurement of the critical time of the joint after the cyclic loading test.
机译：使用聚硅氧烷硅树脂YR3370（GE Toshiba Silicones）作为接合材料来制造烧结碳化硅（SSiC）之间的接头。样品在1100℃至1300℃的温度下以99.99％的氮气流量进行热处理。在1200℃下，接头的三点弯曲强度最大达到179MPa。接合层是连续的，均匀的和致密的，并且具有2μm-5μm的厚度。接合机理是由硅树脂YR3370热解的非晶碳氧硅（Si_xO_yC_z）陶瓷充当SSiC衬底的无机粘合剂，这意味着在Si_xO_yC_z结构和SSiC衬底之间形成连续的Si-C键结构。陶瓷接头的寿命预测可以通过测量循环载荷试验后接头的临界时间来实现。

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