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How advanced low coefficient of thermal expansion (CTE) laminates and prepregs can improve the reliability of printed circuit boards (PCBs)

机译：先进的低热膨胀系数（CTE）层压板和预浸料如何提高印刷电路板（PCB）的可靠性

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摘要

This paper details the impact of "Coefficient of Thermal Expansion" (CTE) imbalances caused by the different materials used in a Printed Circuit Board (PCB). It will also provide guidance as to how the PCB manufacturing process can be modified to accommodate the new requirements from PCB fabricators, assemblers and OEMs for high dimensional consistency of the laminate and prepreg to improve manufacturing yields in bare PCB fabrication, in assembly and during the life-cycle of the electronic device in the field. The paper also explains the risks associated with metal migration and cathodic/anodic filaments (CAF) in PCBs, the impact of a lower CTE and a lower dielectric constant (Dk), as well as the need to minimise the differences of CTE between the PCB laminate and the package/chip in order to better manage the higher stress incurred by the use of lead-free soldering materials. New materials are discussed which are processable in standard PCB fabrication lines, and which can accommodate the needs engendered by halogen-free resin systems.
机译：本文详细介绍了由印刷电路板（PCB）中使用的不同材料引起的“热膨胀系数”（CTE）不平衡的影响。它还将提供有关如何修改PCB制造工艺以适应PCB制造商，组装商和OEM的新要求的指导，以实现层压板和预浸料的高尺寸一致性，以提高裸露PCB制造，组装以及装配过程中的生产良率。电子设备在现场的生命周期。本文还解释了与PCB中的金属迁移和阴极/阳极丝（CAF）相关的风险，较低的CTE和较低的介电常数（Dk）的影响，以及需要最小化PCB之间的CTE差异层压板和封装/芯片，以便更好地管理使用无铅焊接材料引起的更高应力。讨论了可以在标准PCB生产线中加工的新材料，这些新材料可以满足无卤素树脂系统带来的需求。

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