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INSULATING RESIN COMPOSITION HAVING LOW COEFFICIENT OF THERMAL EXPANSION FOR PRINTED CIRCUIT BOARD, AND PREPREG AND PRINTED CIRCUIT BOARD USING SAME
INSULATING RESIN COMPOSITION HAVING LOW COEFFICIENT OF THERMAL EXPANSION FOR PRINTED CIRCUIT BOARD, AND PREPREG AND PRINTED CIRCUIT BOARD USING SAME
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机译：印刷电路板，预浸料和印刷电路板的热膨胀系数低的树脂组合物的使用方法
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摘要
The present invention relates to an insulating resin composition including an epoxy resin, a polyamic acid solution, a curing agent, and an inorganic filler for a printed circuit board, using a polyamic acid which is a precursor of polyimide to increase processability of an insulating resin composition and have an effect of reducing the coefficient of thermal expansion of an insulation layer.;COPYRIGHT KIPO 2014
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