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首页> 外文期刊>Components, Packaging and Manufacturing Technology, IEEE Transactions on >Tunable Peeling Technique and Mechanism of Thin Chip From Compliant Adhesive Tapes
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Tunable Peeling Technique and Mechanism of Thin Chip From Compliant Adhesive Tapes

机译：合格胶带对薄芯片的可调剥离技术及机理

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摘要

The efficient pick-up of thin/ultrathin integrated circuit chip from the wafer is one of the key techniques in advanced microelectronic packaging, whose success rates are determined by the peeling-off of chip from the adhesive tapes. Analytical models for estimating the effects on process parameters represent important design tools. Here, solutions for adhesive stresses and mixed-mode peeling are presented in chip-adhesive-substrate structure based on mixed boundary conditions, in which the geometrical dimensions and material properties of this three-layer system are included. Analytical expressions are defined in terms of structural parameters and several integration constants, which can be obtained by a given system of linear equations. These models agree well with finite element models with virtual crack-closure technique. In particular, the mechanism of tunable mode peeling is uncovered, and the technological limit of normal single ejecting needle is discussed.
机译：从晶片上有效地拾取薄/超薄集成电路芯片是高级微电子封装中的关键技术之一，其成功率取决于从胶带上剥离芯片。用于估计对过程参数的影响的分析模型代表了重要的设计工具。在此，基于混合边界条件，在芯片-粘合剂-基板结构中提出了用于粘合应力和混合模式剥离的解决方案，其中包括了该三层系统的几何尺寸和材料特性。解析表达式是根据结构参数和几个积分常数定义的，这些常数可以通过给定的线性方程组获得。这些模型与采用虚拟裂纹闭合技术的有限元模型非常吻合。特别是，揭示了可调节模式剥离的机理，并讨论了普通单顶针的技术极限。

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