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Investigation of the Correlation between IC Chip Pick-up Performance and Peeling Behavior of Adhesive Tapes

机译:IC芯片拾取性能与胶带剥离行为的相关性研究

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It was investigated that the influences of the peeling behavior of adhesive tapes in peeling tests on IC chip pick-up performance. Needles peel off an IC chip with an adhesive film from the base material in the pick-up process, by sticking out the backside of the base material. In the case that the peeling forces of the adhesive tape decrease as the peeling speeds increase in peeling tests, only two kinds of behaviors were observed in pick-up test;;the peeling propagated little and the IC chip was not peeled off under critical needle displacement while the pick-up was completed instantaneously over critical needle displacement. In the case that the peeling forces of the adhesive tape increase as the peeling speeds increase, the pick-up time decreased as the needle displacement increased. As a result, it can be concluded that the needle displacement where the peeling propagates instantaneously is critical for succeeded pick-up if the peeling forces of the adhesive tape decrease as the peeling speeds increase. If the peeling forces of the adhesive tape increase as the peeling speeds increase, the information of peeling speeds at each needle displacement are needed to estimate how long it takes to pick-up a chip.
机译:研究了胶带剥离行为对IC芯片拾取性能的剥离试验的影响。通过伸出基材的背面,针从基材的基材中用粘合膜剥离IC芯片。在剥离速度随着剥离试验的增加随着剥离速度的增加而降低的情况下,在拾取试验中只观察到两种行为;;剥离在临界针下没有剥离IC芯片拾取的位移在瞬时完成,在关键针位移上完成。在粘合带的剥离力随着剥离速度的增加而增加的情况下,随着针位移增加,拾取时间减小。结果,可以得出结论:如果胶带随着剥离速度的增加,如果粘合带的剥离力减小,则剥离瞬间传播的针位移对于成功的拾取是至关重要的。如果粘合带的剥离力随着剥离速度的增加而增加,则需要在每个针位移时剥离速度的信息来估计拾取芯片所需的时间。

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