首页> 外国专利> Adhesive tape peeling device, method of peeling sticky tape, semiconductor chip pickup device, method of manufacturing a semiconductor chip pickup method and semiconductor device

Adhesive tape peeling device, method of peeling sticky tape, semiconductor chip pickup device, method of manufacturing a semiconductor chip pickup method and semiconductor device

机译：胶带剥离装置，剥离胶带的方法，半导体芯片拾取装置，半导体芯片拾取方法的制造方法和半导体装置

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摘要

PPROBLEM TO BE SOLVED: To manufacture a high-quality semiconductor device by reducing the occurrence of failures, such as cracks, chipping of a semiconductor chip, and at the same time, to suppress deterioration of the manufacturing yield of the semiconductor device. PSOLUTION: A peeling mechanism which peels an adhesive tape 24 stuck to a single semiconductor wafer 1 fixes the wafer 1 through adsorption by means of a porous material 2 separated into at least two adsorption region 2-1 to 2-7 in the peeling direction of the tape 24. Since the semiconductor wafer 1 can be fixed effectively by adsorption according to the peeling position of the tape 24, cracks or chipping of the semiconductor chip which occurs at peeling of the tape 24 can be prevented. PCOPYRIGHT: (C)2003,JPO

机译：

要解决的问题：通过减少诸如裂纹，半导体芯片的碎裂之类的故障的发生来制造高质量的半导体器件，同时抑制半导体器件的制造良率的下降。。

解决方案：剥离机构，其剥离粘附在单个半导体晶片1上的胶带24，该晶片通过利用在至少两个吸附区域2-1至2-7中分离的多孔材料2的吸附而通过吸附固定晶片1。带24的剥离方向。由于能够通过吸附根据带24的剥离位置有效地固定半导体晶片1，因此能够防止在带24的剥离时产生的半导体芯片的破裂或碎裂。

版权：（C）2003，日本特许厅展开▼

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公开/公告号JP4266106B2

专利类型
公开/公告日2009-05-20

原文格式PDF
申请/专利权人株式会社東芝;
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申请/专利号JP20020271536
发明设计人黒澤哲也;田久真也;
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申请日2002-09-18
分类号H01L21/683;H01L21/67;H01L21/301;H01L21/52;
国家 JP
入库时间 2022-08-21 19:39:15

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