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首页> 外文期刊>IEEE Transactions on Components and Packaging Technologies >Packaging Effect on MEMS Pressure Sensor Performance
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Packaging Effect on MEMS Pressure Sensor Performance

机译：封装对MEMS压力传感器性能的影响

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摘要

In this study, the effect of epoxy based molding compound packaging on a micro-electro-mechanical system (MEMS) pressure sensor performance is investigated. A series of experiments were conducted to characterize the MEMS sensor over temperature and pressure changes by measuring output voltage signals. The sensor was modeled by a finite element method to investigate the stress developments. The molding compound was assumed as elastic and viscoelastic material to examine the material modeling effect on the calculation results. The model was verified by comparing the calculated results with experimental data. It was found that the stress induced by the molding compound had significant influence on the sensor performance, and the accuracy of the calculations was highly dependent on the modeling of the molding compound. Based on the results, the mechanism of the stress development and its effect on the sensor signal were discussed
机译：在这项研究中，研究了基于环氧树脂的模塑料封装对微机电系统（MEMS）压力传感器性能的影响。进行了一系列实验，通过测量输出电压信号来表征MEMS传感器在温度和压力变化方面的特性。通过有限元方法对传感器进行建模，以研究应力的变化。假定模塑料为弹性和粘弹性材料，以检查材料建模对计算结果的影响。通过将计算结果与实验数据进行比较来验证模型。发现由模塑料引起的应力对传感器性能具有显着影响，并且计算的准确性高度依赖于模塑料的模型。根据结果​​，讨论了应力发展的机理及其对传感器信号的影响。

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