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首页> 外文期刊>Composite Structures >Low cost technique for detecting adhesive debonding damage of glass epoxy composite plate using an impedance based non-destructive testing method
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Low cost technique for detecting adhesive debonding damage of glass epoxy composite plate using an impedance based non-destructive testing method

机译：使用基于阻抗的无损检测方法检测环氧玻璃复合板胶粘剂脱胶损伤的低成本技术

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摘要

In general, components in composite structures are usually achieved with adhesive bonding, a preferred choice over a conventional mechanical fastening approach. For this reason, debonding of an adhesive layer can be a serious problem as the reliability of the overall structure is influenced by its adhesion characteristics. In addition due to the fact that composites can be formed into various shapes and sizes with ease, this creates a challenging problem for the non-destructive testing (NDT) methods when detecting damage. In this study, a relatively new contact NDT method known as the electromechanical impedance method is used to detect adhesive debonding of glass epoxy composite plates. Furthermore, a metal wire concept is utilized to monitor up to three composite plates using a single impedance measuring device. To achieve this, various piezoelectric transducers are cut into different sizes and connected in series. The results from the experiments introduced in this study shows promising outcome which opens up new possibilities in the field of NDT.
机译：通常，复合结构中的组件通常通过粘合剂粘合来实现，这是相对于常规机械紧固方法的首选。因此，由于整个结构的可靠性受其粘合特性影响，因此粘合剂层的剥离可能是一个严重的问题。此外，由于可以轻松地将复合材料制成各种形状和尺寸，因此，在检测损坏时，这对无损检测（NDT）方法造成了挑战。在这项研究中，一种相对较新的接触无损检测方法，即机电阻抗方法，被用于检测环氧玻璃复合板的粘合剂剥离。此外，使用金属线概念可通过单个阻抗测量设备监视多达三个复合板。为此，将各种压电换能器切成不同的尺寸并串联连接。这项研究中引入的实验结果显示出令人鼓舞的结果，这为无损检测领域开辟了新的可能性。

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