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首页> 外文期刊>International Journal of Electrochemical Science >Electrochemical Corrosion and Wear Behavior of an Ultra-thin DLC Film Deposited on Different Annealing Ni-P Layers on Al- Mg Alloy in NaCl Solution
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Electrochemical Corrosion and Wear Behavior of an Ultra-thin DLC Film Deposited on Different Annealing Ni-P Layers on Al- Mg Alloy in NaCl Solution

机译：NaCl溶液中Al-Mg合金不同退火Ni-P层上沉积的超薄DLC膜的电化学腐蚀和磨损行为

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This study evaluated the electrochemical corrosion and wear behavior of an ultra-thin diamond-likecarbon film on various annealing electroless Ni-P coatings on an Al-Mg alloy media plank in 3.5wt.%NaCl solution. The annealing process was performed at different temperatures from 230C to 280C.The results indicated that annealing increased the hardness of electroless Ni-P coatings to an extentthat increased with annealing temperature by causing the precipitation of Ni3P, and this furtherresulting that the electrochemical corrosion resistance of electroless Ni-P coatings fell as the annealingtemperature increased. Annealing electroless Ni-P coatings on which were deposited a diamond-likecarbon film increased their hardness to an extent that increased with annealing temperature, but thediamond-like carbon film did not increase hardness when the annealing temperature was 280C. Up tothis temperature, annealing was more effective than depositing an ultra-thin diamond-like carbon filmin strengthening the electroless Ni-P coatings. The results of the wear corrosion test demonstrated thatdepositing an ultra- thin diamond-like carbon film on electroless Ni-P coatings, those had beenannealed at low temperature improved their wear corrosion resistance. However, the Ni-P coatings thatwas annealed at high temperature of 280C and was covered by a diamond-like carbon ultra-thin filmexhibited significantly wear corrosion failure. The wear corrosion failure was attributed to the fact thatincreasing the annealing temperature increased the hardness of the Ni-P coating while weakening theadhesion of the hard diamond-like carbon film on it.
机译：这项研究评估了在3.5％重量的NaCl溶液中的Al-Mg合金介质板上各种化学退火Ni-P涂层上的超薄类金刚石碳薄膜的电化学腐蚀和磨损行为。退火过程在230℃至280℃的不同温度下进行。结果表明，退火会导致Ni3P的析出，从而使化学镀Ni-P涂层的硬度增加到一定程度，并随退火温度的升高而增加，这进一步导致了Ni3P的耐电化学腐蚀性能Ni-P化学镀层随着退火温度的升高而下降。对其上淀积了类金刚石碳膜的化学镀Ni-P涂层进行退火处理后，其硬度随退火温度的增加而增加，但当退火温度为280℃时，类金刚石碳膜的硬度没有增加。在此温度下，退火比沉积超薄类金刚石碳膜更有效地增强了化学镀Ni-P涂层的效率。磨损腐蚀试验的结果表明，在化学镀Ni-P涂层上沉积超薄类金刚石碳膜后，在低温下进行了退火，可以提高其耐磨蚀性。然而，在280℃的高温下退火并被类金刚石碳超薄膜覆盖的Ni-P涂层表现出明显的磨损腐蚀失效。磨损腐蚀失效归因于以下事实：提高退火温度会增加Ni-P涂层的硬度，同时会削弱其上坚硬的类金刚石碳膜的附着力。

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