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首页> 外文期刊>ISIJ international >Growth Rate of Copper Sulfide Precipitates in Solid Low Carbon Steel
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Growth Rate of Copper Sulfide Precipitates in Solid Low Carbon Steel

机译：固态低碳钢中硫化铜沉淀的生长速率

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The kinetics of copper sulfide growth has been investigated using low carbon steel samples such as Fe-0.3mass%Cu-0.03mass%S-0.1mass%C and Fe-0.1mass%Cu-0.01 mass%S-0.1mass%C. The samples were heat-treated at 1273, 1423 and 1573 K for 100 s – 14.4 ks for precipitation of copper sulfides and then subjected to observation by a scanning electron microscope (SEM) and a transmission electron microscope (TEM) to measure the size of copper sulfides precipitated in the samples. The growth kinetics of copper sulfides has been found to be well described by the Ostwald ripening model, as follows:where R_(t) and R _(0) are the radii of copper sulfide precipitates, respectively, at t = t and t = 0 where t is time, k _(O) is the rate constant in this model and T is thermodynamic temperature. The diffusion coefficients and activation energy derived from values of k _(O) are close to those of copper in austenitic iron. On the basis of the growth kinetics, it has been proposed that the heat-treatment for as-cast strip steel should be conducted at around 1273 K, at which the size of copper sulfide precipitates can be controlled to be as small as 20–30 nm in several tens of minutes.
机译：已使用低碳钢样品（例如Fe-0.3质量％Cu-0.03质量％S-0.1质量％C和Fe-0.1质量％Cu-0.01质量％S-0.1质量％C）研究了硫化铜的生长动力学。样品在1273、1423和1573 K下进行了100 s – 14.4 ks的热处理，以沉淀出硫化铜，然后通过扫描电子显微镜（SEM）和透射电子显微镜（TEM）进行观察，以测量样品的尺寸。硫化铜沉淀在样品中。奥斯特瓦尔德熟化模型已很好地描述了硫化铜的生长动力学，如下所示：其中Ri（t）和Ri（0）分别是硫化铜沉淀的半径，在 t = t和 t = 0，其中 t是时间， k _（O）是此模型中的速率常数， T是热力学温度。从k_（O）的值导出的扩散系数和活化能接近于奥氏体铁中的铜。根据生长动力学，建议铸态带钢的热处理应在大约1273 K左右进行，在此温度下，硫化铜沉淀物的大小可以控制在20-30之间在数十分钟内达到nm。

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