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首页> 外文期刊>Proceedings >Finite Element Method Simulation and Characterization of a Thermal Flow Sensor Based on Printed Circuit Board Technology for Various Fluids
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Finite Element Method Simulation and Characterization of a Thermal Flow Sensor Based on Printed Circuit Board Technology for Various Fluids

机译：基于印刷电路板技术的各种流体热流传感器的有限元方法仿真与表征

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摘要

We present finite element method (FEM) simulations of a thermal flow sensor as well as a comparison to measurement results. The thermal sensor is purely based on printed circuit board (PCB) technology, designed for heating, ventilation, and air conditioning (HVAC) systems. Design and readout method of the sensor enables the possibility to measure the flow velocity in various fluids. 2D-FEM simulations were carried out in order to predict the sensor characteristic of envisaged setups. The simulations enable a fast and easy way to evaluate the sensora??s behaviour in different fluids. The results of the FEM simulations are compared to measurements in a real environment, proving the credibility of the model.
机译：我们介绍了热流量传感器的有限元方法（FEM）仿真以及与测量结果的比较。该热传感器完全基于印刷电路板（PCB）技术，专为加热，通风和空调（HVAC）系统而设计。传感器的设计和读出方法使测量各种流体中的流速成为可能。进行了2D-FEM仿真，以预测设想设置的传感器特性。这些模拟提供了一种快速简便的方法来评估传感器在不同流体中的行为。将FEM仿真的结果与实际环境中的测量结果进行比较，证明了该模型的可靠性。

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