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Quality and Yield Improvement of Barrel Tin Plating Process for SMX Semiconductor Packages

机译:SMX半导体封装的滚镀锡工艺的质量和良率的提高

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Most of semiconductor solderability improvement is done using tin. The tin plating can be done in lead frame or barrel. Barrel tin electroplating process for Surface Mount X (SMX) semiconductor packages has a distinct advantage: the ability to finish a greater volume of work for a specified time period. However, as the SMX packages are applied in critical automotive and medical fields, barrel tin plating also faces yield and quality challenges. This work discusses the common rejects and some solutions to improve the quality and yield of barrel tin plating process for SubMinitature version B (SMB) semiconductor packages. Among the common rejects are missing plating, burn mark, unit coupling, lead discoloration and crack package. The ?improvement efforts are the introduction of metal ballast to improve conductivity and reduce missing plating, improvement of solution filtration to avoid discoloration, addition of ‘Zig-zag balls’ to reduce? unit coupling, auto tracking of ampere spike that causes crack package and vision system to further screen out rejects. As a result, SMX barrel plating yield can be increased to more than 99.8% and there are continuous effort to further improve yield and quality.
机译:大多数半导体可焊性的改进都是使用锡完成的。镀锡可以在引线框架或枪管中进行。用于表面贴装X(SMX)半导体封装的桶状锡电镀工艺具有明显的优势:能够在指定的时间段内完成大量工作。然而,由于SMX封装已应用于关键的汽车和医疗领域,滚镀锡也面临着产量和质量方面的挑战。这项工作讨论了常见的废品以及提高SubMinitature B版(SMB)半导体封装的滚镀锡工艺的质量和成品率的一些解决方案。常见的次品包括镀层缺失,烧伤痕迹,单元耦合,引线变色和裂纹。 “改进工作”是引入金属镇流器以提高导电性并减少镀层遗失,改进溶液过滤以避免变色,添加“ Z字形球”以减少污染?单元耦合,自动跟踪安培峰值,使裂纹包装和视觉系统进一步筛选出次品。结果,SMX滚镀的产率可以提高到99.8%以上,并且需要不断努力以进一步提高产率和质量。

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