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Effect of copper oxide shell thickness on flash light sintering of copper nanoparticle ink

机译：氧化铜壳厚度对铜纳米颗粒油墨闪光烧结的影响

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In this study, the effect of the thickness of a copper oxide-shell on flash light sintering of Cu nanoparticles (NPs) was investigated. The electrical properties of Cu nano-ink films with various oxide-shell thicknesses were examined by measuring the sheet resistance. Furthermore, the amount of PVP in the Cu NP-ink was varied to reduce the copper oxide-shell efficiently and enhance the flash light sintering of the Cu NPs. Also, to investigate the reduction and sintering phenomena of Cu NPs with respect to the copper oxide shell thickness, the sheet resistances of the Cu films were measured in real-time using an in situ resistance measuring system during the flash light sintering process. The results of this study established the maximum allowable thickness of the copper oxide shell that allows flash light sintering and also provided the optimal amount of PVP in Cu nano-ink for a particular copper oxide shell thickness.
机译：在这项研究中，研究了氧化铜壳的厚度对Cu纳米粒子（NPs）闪光烧结的影响。通过测量薄层电阻来检查具有各种氧化物壳厚度的Cu纳米油墨膜的电性能。此外，改变了Cu NP墨水中的PVP的量以有效地减少氧化铜壳并增强Cu NP的闪光烧结。另外，为了研究Cu NPs相对于氧化铜壳厚度的还原和烧结现象，在测量过程中使用原位电阻测量系统实时测量了Cu薄膜的薄层电阻。闪光灯烧结工艺。这项研究的结果确定了允许闪光灯烧结的氧化铜壳的最大允许厚度，并且还为特定的氧化铜壳厚度提供了铜纳米油墨中的最佳PVP量。

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