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A Simulation Study of Hot Carrier Effects in SoI-Like Bulk Silicon nMOS Device

机译:SoI型块状硅nMOS器件中热载流子效应的仿真研究

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摘要

A silicon-on-insulator (SoI)-like bulk silicon (SLBS) MOSFET structure is studied and compared against a fully depleted (FD) SoI MOSFET using 2-D numerical simulations. A p/p structure was contained in SLBS device, in which n is made of 4H-SiC. This n layer is FD. Hot carrier (HC) effects (HCEs) in proposed SLBS nMOSFET were simulated and compared with that in FD SoI nMOSFET. In this paper, HC-induced device degradation is characterized under different temperatures. HCE of SLBS always has an advantage over that of SoI. The worst case bias condition for HCEs has also been studied and was found as .
机译:研究了一种类似于绝缘体上硅(SoI)的体硅(SLBS)MOSFET结构,并使用二维数值模拟将其与完全耗尽(FD)的SoI MOSFET进行了比较。 SLBS装置中包含p / n / p结构,其中n由4H-SiC制成。该n层是FD。模拟了拟议的SLBS nMOSFET中的热载流子(HC)效应,并将其与FD SoI nMOSFET中的热载流子效应进行了比较。在本文中,在不同温度下表征了HC引起的器件降解。 SLBS的HCE始终比SoI具有优势。对HCE的最坏情况下的偏斜条件也进行了研究,发现为。

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