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Generalized Procedure for Improved Accuracy of Thermal Contact Resistance Measurements for Materials With Arbitrary Temperature-Dependent Thermal Conductivity

机译：具有随温度变化的导热系数的材料的热接触电阻测量精度的通用程序

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摘要

Thermal contact resistance (TCR) is most commonly measured using one-dimensional steady-state calorimetric techniques. In these experimental methods, a temperature gradient is applied across two contacting beams and the temperature drop at the interface is inferred from the temperature profiles of the rods that are measured at discrete points. During data analysis, thermal conductivity of the beams is typically taken to be an average value over the temperature range imposed during the experiment. Here, a generalized theory is presented that accounts for temperature-dependent changes in thermal conductivity. The procedure presented enables accurate measurement of TCR for contacting materials whose thermal conductivity is any arbitrary function of temperature. For example, it is shown that the standard technique yields TCR values that are about 15% below the actual value for two specific examples of copper and silicon contacts. On the other hand, the generalized technique predicts TCR values that are within 1% of the actual value. The method is exact when thermal conductivity is known exactly and no other errors are introduced to the system.
机译：热接触电阻（TCR）最通常使用一维稳态量热技术进行测量。在这些实验方法中，跨两个接触梁施加温度梯度，并且根据在离散点测量的棒的温度曲线推断界面处的温度下降。在数据分析期间，通常将梁的热导率视为实验过程中施加的温度范围内的平均值。在此，提出了一种广义理论，该理论解释了导热系数随温度变化的情况。所介绍的程序可以对热导率是温度的任意函数的接触材料进行TCR的精确测量。例如，表明对于铜和硅触点的两个特定示例，标准技术产生的TCR值比实际值低约15％。另一方面，通用技术预测的TCR值在实际值的1％以内。当热导率准确已知且系统没有其他错误时，该方法才是准确的。

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  • 来源
    《Heat Transfer Engineering》 |2015年第8期|433-438|共6页
  • 作者

    ROBERT A. SAYER;

  • 作者单位

    Engineering Sciences Center, Sandia National Laboratories, PO Box 5800, Albuquerque, NM 87185, USA;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
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  • 正文语种 eng
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