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首页> 外文期刊>IEEE transactions on electronics packaging manufacturing >Smart tooling for assembly of thin flexible systems
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Smart tooling for assembly of thin flexible systems

机译：用于薄型柔性系统组装的智能工具

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Emerging electronic assemblies are demanding lower cost, lighter weight, miniaturized packages mounted on thin flexible circuit boards and/or flex circuits. However, the compliant nature of the flex substrates poses new processing technology challenges for standard surface mount assembly equipment. A particular challenge is fixture tooling. The flexible substrate experiences significant transverse displacements under perpendicular assembly and/or fixturing forces during solder paste printing and component placement processes. The transverse displacements result in misregistration of the component leads and substrate bond pads, leading to severe assembly process defects. The solder reflow process further complicates the issue due to the thermo-mechanical warpage induced. Conventional assembly equipment utilizes dedicated tooling designed to handle rigid circuit board assemblies. As electronic assemblies move toward very fine pitch surface mount packages, chip scale packages, and flip chip attachment assembled to thin flexible double-sided circuit boards, reengineered and specialized dedicated tooling for fixturing flexible substrates in standard assembly equipment are becoming extremely important. This paper focuses on developing analysis methodologies and theories for implementing machine dedicated Smart Tooling. The primary goals being to determine the impact of fixturing on assembly process quality and to determine optimum fixturing configurations for thin flexible circuit board assemblies based on circuit design data. A mathematical model to describe both transverse and perpendicular displacements of flex substrates is developed, and its closed form solution for transverse displacements is obtained. Fixturing configurations based on a perimeter support technique of flex substrates is analyzed to minimize transverse displacements.
机译：新兴的电子组件要求安装在薄的柔性电路板上和/或柔性电路上的成本更低，重量更轻，微型化的封装。然而，柔性基板的顺应性对于标准的表面安装组装设备提出了新的加工技术挑战。一个特殊的挑战是夹具工具。在焊膏印刷和元件放置过程中，柔性基板在垂直组装和/或固定力的作用下会经历明显的横向位移。横向位移导致元件引线和基板键合焊盘未对准，从而导致严重的组装工艺缺陷。由于诱发的热机械翘曲，焊料的回流工艺使问题变得更加复杂。传统的组装设备采用专门的工具设计来处理刚性电路板组件。随着电子组件向极细间距的表面安装封装，芯片级封装和倒装芯片附件组装到薄的柔性双面电路板上，用于在标准组装设备中固定柔性基板的重新设计和专用工具变得越来越重要。本文着重于开发用于实现机器专用智能工具的分析方法和理论。主要目标是确定夹具对组装工艺质量的影响，并根据电路设计数据确定薄柔性电路板组件的最佳夹具配置。建立了描述柔性基板横向和纵向位移的数学模型，并获得了横向位移的封闭形式解。分析了基于柔性基板周边支撑技术的夹具配置，以最大程度地减少横向位移。

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