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首页> 外文期刊>IEICE Transactions on Electronics >Inductor and TSV Design of 20-V Boost Converter for Low Power 3D Solid State Drive with NAND Flash Memories
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Inductor and TSV Design of 20-V Boost Converter for Low Power 3D Solid State Drive with NAND Flash Memories

机译：具有NAND闪存的低功耗3D固态驱动器的20V Boost转换器的电感器和TSV设计

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摘要

Two essential technologies for a 3D Solid State Drive (3D-SSD) with a boost converter are presented in this paper. The first topic is the spiral inductor design which determines the performance of the boost converter, and the second is the effect of TSV's on the boost converter. These techniques are very important in achieving a 3D-SSD with a boost converter. In the design of the inductor, the on-board inductor from 250 nH to 320 nH is the best design feature that meets all requirements, including high output voltage above 20 V, fast rise time, low energy consumption, and area smaller than 25 mm~2. The use of a boost converter with the proposed inductor leads to a reduction of the energy consumption during the write operation of the proposed 1.8-V 3D-SSD by 68% compared with the conventional 3.3-V 3D-SSD with the charge pump. The feasibility of 3D-SSD's with Through Silicon Vias (TSV's) connections is also discussed. In order to maintain the advantages of the boost converter over the charge pump, the reduction of the parasitic resistance of TSV's is very important.
机译：本文介绍了具有升压转换器的3D固态驱动器（3D-SSD）的两项基本技术。第一个主题是确定升压转换器性能的螺旋电感器设计，第二个主题是TSV对升压转换器的影响。这些技术对于通过升压转换器实现3D-SSD非常重要。在电感器的设计中，250 nH至320 nH的板载电感器是满足所有要求的最佳设计功能，包括高于20 V的高输出电压，快速上升时间，低能耗以及小于25 mm的面积〜2。与带有电荷泵的传统3.3V 3D-SSD相比，将带有建议电感器的升压转换器与建议的1.8V 3D-SSD进行写操作期间的能耗降低了68％。还讨论了通过硅过孔（TSV）连接的3D-SSD的可行性。为了保持升压转换器优于电荷泵的优势，降低TSV的寄生电阻非常重要。

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