Ultra-thin semiconductor wafer applications and processes

Keith Gurnett; Tom Adams

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Ultra-thin semiconductor wafer applications and processes

机译：超薄半导体晶圆的应用和工艺

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Within the last few years, backside thinning of fully processed IC wafers has become a widely used technique in the search for high speed in advanced package technologies. Figure 1 shows the trend in finished IC thickness used in advanced packaging based on thickness figures quoted by various sources over the last ten years. The market potential for ultra-thin wafers, with backside metallization, is estimated by market researchers to be above 40% of the wafer market by the year 2010.

机译：在过去的几年中，完全加工的IC晶圆的背面薄化已成为寻求先进封装技术高速化的一种广泛使用的技术。图1根据过去十年间各种来源引用的厚度数据显示了高级封装中IC成品厚度的趋势。市场研究人员估计，具有背面金属化的超薄晶圆的市场潜力到2010年将超过晶圆市场的40％。

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《III-Vs Review》 |2006年第4期|p.38-40|共3页
作者
Keith Gurnett; Tom Adams;
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中图分类无线电电子学、电信技术;
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Ultra-thin semiconductor wafer applications and processes

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