Crack propagation behavior of Sn-3.5Ag solder in low cycle fatigue

Mineo Nozaki; Masao Sakane; Yutaka Tsukada

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Crack propagation behavior of Sn-3.5Ag solder in low cycle fatigue

机译：低循环疲劳条件下Sn-3.5Ag焊料的裂纹扩展行为

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This work studies the low cycle fatigue crack propagation for three types of notched specimens of Sn-3.5Ag lead free solder. Low cycle fatigue tests were carried out using circumferential notched specimens. The fatigue life for crack initiation and propagation were experimentally obtained. The applicability of stress intensity factor range, J-integral range and strain intensity factor range for correlating the crack propagation rates was discussed. It was observed that the three fracture mechanics parameters did not correlate the crack propagation rates in a whole propagation stage with a small scatter but the stress intensity factor and J-integral ranges correlated the saturated crack propagation rates with a small scatter.

机译：这项工作研究了三种类型的Sn-3.5Ag无铅焊料的缺口试样的低周疲劳裂纹扩展。使用周向缺口试样进行低周疲劳试验。实验获得了裂纹萌生和扩展的疲劳寿命。讨论了应力强度因子范围，J积分范围和应变强度因子范围与裂纹扩展速率相关的适用性。可以看出，三个断裂力学参数与整个扩展阶段的裂纹扩展速率不相关，且散度较小，而应力强度因子和J积分范围与饱和裂纹扩展速率相关性较小。

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来源
《International Journal of Fatigue》 |2008年第11期|1729-1736|共8页
作者
Mineo Nozaki; Masao Sakane; Yutaka Tsukada;
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作者单位

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收录信息美国《科学引文索引》(SCI);美国《工程索引》(EI);
原文格式 PDF
正文语种 eng
中图分类
关键词
low cycle fatigue; crack propagation; stress intensity factor; J-integral; strain intensity factor;

机译：低周疲劳;裂纹扩展应力强度因子J积分应变强度因子;

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1. Thermal Cycling Aging Effect on the Shear Strength, Microstructure, Intermetallic Compounds (IMC) and Crack Initiation and Propagation of Reflow Soldered Sn-3.8Ag-0.7Cu and Wave Soldered Sn-3.5Ag Ceramic Chip Components [J] . Andersson C., Tegehall P.-E., Andersson D. R., IEEE Transactions on Components and Packaging Technologies . 2008,第2期

机译：热循环时效对回流焊Sn-3.8Ag-0.7Cu和波峰焊Sn-3.5Ag陶瓷芯片组件的剪切强度，显微组织，金属间化合物（IMC）以及裂纹萌生和传播的影响
2. Effect of different temperature cycling profiles on the crack initiation and propagation of Sn-3.5Ag wave soldered solder joints [J] . C. Andersson, D.R. Andersson, P.E. Tegehall, Microelectronics & Reliability . 2007,第2a3期

机译：不同温度循环曲线对Sn-3.5Ag波峰焊焊点裂纹萌生和扩展的影响
3. Low cycle fatigue and fatigue crack growth behavior of Sn-Ag eutectic solder [J] . C. Kanchanomai, Y. Miyashita, Y. Mutoh, Soldering & Surface Mount Technology . 2002,第3期

机译：Sn-Ag共晶焊料的低周疲劳和疲劳裂纹扩展行为
4. Crack Initiation and Propagation Behavior of Pb-Sn Solders in Torsion Low Cycle Fatigue [C] . Haruo NOSE, Masao SAKANE, Hiroshi FURUSAWA, Progress in Mechanical Behaviour of Materials . 1999

机译：Pb-Sn焊料在扭转低周疲劳中的裂纹萌生和扩展行为
5. Development of crack propagation models for solder joints under creep-fatigue conditions. [D] . Sangalli, Nicoletta. 2001

机译：开发蠕变疲劳条件下焊点的裂纹扩展模型。
6. Very High Cycle Fatigue Failure Analysis and Life Prediction of Cr-Ni-W Gear Steel Based on Crack Initiation and Growth Behaviors [O] . Hailong Deng, Wei Li, Tatsuo Sakai, 2015

机译：基于裂纹萌生和生长行为的Cr-Ni-W齿轮钢超高周疲劳失效分析和寿命预测
7. Low-Cycle Fatigue Life Definition for Sn-3.5Ag and Sn-0.7Cu Lead-free Solders Using Surface Deformation [O] . Takehiko TAKAHASHI, Susumu HIOKI, Ikuo SHOHJI, 2006

机译：SN-3.5AG和SN-0.7CU使用表面变形的无铅焊料的低循环疲劳寿命定义
8. Propagation behavior of small cracks in 304 stainless steel under biaxial low-cycle fatigue at elevated temperature. [R] . T. Ogata A. Nitta J. J. Blass 1991

机译：高温双轴低周疲劳下304不锈钢小裂纹的扩展行为。

Crack propagation behavior of Sn-3.5Ag solder in low cycle fatigue

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