Thermal management of electronics devices with PCMs filled pin-fin heat sinks: A comparison

著录项

• 来源
  《International Journal of Heat and Mass Transfer》 |2018年第2期|1199-1204|共6页
• 作者

  Hafiz Muhammad Ali; Adeel Arshad; Mark Jabbal; P.G. Verdin;

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• 作者单位

  Department of Mechanical Engineering, University of Engineering and Technology, Taxila, Pakistan;

  Fluids & Thermal Engineering (FLUTE) Research Group, Faculty of Engineering, University of Nottingham, Nottingham NG7 2RD, UK;

  Fluids & Thermal Engineering (FLUTE) Research Group, Faculty of Engineering, University of Nottingham, Nottingham NG7 2RD, UK;

  Energy & Power Theme, Cranfield University, Cranfield MK43 OAL, UK;

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• 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
• 原文格式 PDF
• 正文语种 eng
• 中图分类
• 关键词

  Phase change materials (PCMs); Thermal conductivity enhancers (TCEs); Pin-fin heat sinks; Paraffin wax; n-Eicosane; Set point temperatures (SPTs);

  机译：相变材料（PCM）;导热系数增强剂（TCE）;针翅式散热器;石蜡;正二十烷;设定点温度（SPT）;