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Effect of open microchannel geometry on pool boiling enhancement

机译:开放式微通道几何形状对池沸腾增强的影响

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Pool boiling enhancement through surface modification has garnered the attention of many researchers for extending the limits of heat flux dissipation. Simulated copper chips were used in a pool boiling setup with water boiling at atmospheric pressure. Heat transfer performance of different microchanneled surfaces was compared to that of a plain surface. The results of the study showed that the mechanism at work for the bubble dynamics was the ability of the surface to pull liquid through the channels to induce heat transfer. Geometrical trends were observed from the study as well with the wider and deeper channels and thinner finned surfaces showing the best heat transfer results. Without reaching the critical heat flux condition, the best performing chip dissipated a heat flux of 244 W/cm~2 corresponding to a record heat transfer coefficient of 269 kW/m~2 K.
机译:通过表面改性提高池沸腾度已引起许多研究人员的关注,以扩展热通量的限制。在池沸腾装置中使用模拟的铜屑,其中水在大气压下沸腾。将不同微通道表面的传热性能与普通表面的传热性能进行了比较。研究结果表明,气泡动力学起作用的机制是表面将液体拉过通道以引起热传递的能力。从研究中也观察到几何趋势,较宽和较深的通道以及较薄的翅片表面表现出最佳的传热效果。在没有达到临界热通量条件的情况下,性能最佳的芯片耗散了244 W / cm〜2的热通量,对应于创纪录的269 kW / m〜2 K的传热系数。

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