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首页> 外文期刊>International journal of materials and structural integrity >Microstructure and drop/shock reliability of Sn-Ag-Cu-In solder joints
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Microstructure and drop/shock reliability of Sn-Ag-Cu-In solder joints

机译：Sn-Ag-Cu-In焊点的组织和跌落/冲击可靠性

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摘要

The drop/shock reliability of new quaternary Sn-Ag-Cu-ln Pb-free solder alloy with increasing amounts of copper was investigated on the basis of their mechanical properties and microstructures in comparison with ternary Sn-1.2Ag-0.5Cu Pb-free solder alloy and quaternary Sn-1.2Ag-0.5Cu-0.4In Pb-free solder alloy as suggested in a previous work. The results showed that Sn-l.2Ag-0.7Cu-0.4In solder alloy has excellent drop/shock reliability compared to Sn-l.2Ag-0.5Cu and Sn-l.2Ag-0.5Cu-0.4In solder alloys owing to the thin IMC thickness and the increased mechanical strength. It was considered that indium addition restrained the IMC growth and increasing the amount of copper promoted the formation of Cu_6Sn_5 and Ag_3Sn phase, which resulted in an increase in the alloy strength.
机译：根据新型三元锡-银-铜-锡无铅四元锡合金的力学性能和微观结构，与三元锡-1.2Ag-0.5Cu无铅锡合金比较，研究了其下降/冲击可靠性。锡合金和四元Sn-1.2Ag-0.5Cu-0.4In无铅锡合金，如先前工作中所建议。结果表明，Sn-1.2Ag-0.7Cu-0.4In焊料合金与Sn-1.2Ag-0.5Cu和Sn-1.2Ag-0.5Cu-0.4In焊料合金相比，具有出色的跌落/冲击可靠性。薄的IMC厚度和增加的机械强度。认为铟的添加抑制了IMC的生长并且增加铜的量促进了Cu_6Sn_5和Ag_3Sn相的形成，这导致合金强度的增加。

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  • 作者

    A-Mi Yu; Jae-Won Jang; Jong-Hyun Lee; Jun-Ki Kim; Mok-Soon Kim;

  • 作者单位

    Division of Materials Science and Engineering, Inha University, 253, Yonghyun-Dong, Nam-Gu, Incheon 402-751, South Korea;

    Division of Materials Science and Engineering, Inha University, 253, Yonghyun-Dong, Nam-Gu, Incheon 402-751, South Korea;

    Department of Materials Science and Engineering, Seoul National University of Science and Technology, 232, Gongneung-ro, Nowon-gu, Seoul 139-743, South Korea;

    Advanced Welding and Joining R&D Department/Microjoining Center, Korea Institute of Industrial Technology, 7-47, Songdo-Dong, Yeonsu-Gu, Incheon 406-840, South Korea;

    Division of Materials Science and Engineering, Inha University, 253, Yonghyun-Dong, Nam-Gu, Incheon 402-751, South Korea;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    drop/shock reliability; Sn-Ag-Cu-ln alloy; Pb-free solder;

    机译：跌落/冲击可靠性;Sn-Ag-Cu-In合金;无铅焊料;

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